[G-1-02] Impact of Ru Deposition Method and Adhesion Layer on Electrical Performance of Semi-damascene Interconnects

^○Gilles Delie¹, Elisabeth Camerotto², Giulio Marti¹, Ankit Pokhrel¹, Gayle Murdoch¹, Anshul Gupta¹, Stefan Decoster¹, Souvik Kundu¹, Seongho Park¹, Zsolt Tokei¹ (1. imec (Belgium), 2. Lam Research Belgium (Belgium))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 14:30 〜 14:45 |PDF ダウンロード

[G-1-03] Metal Pitch 18nm Semi-Damascene Spacer-is-Dielectric SADP Process Integration for Beyond A10 Technology Node

^○Chen Wu¹, Vincent Renaud¹, Stephane Lariviere¹, Stefan Decoster¹, Yannick Hermans¹, Quoc Toan Le¹, Hanne DeCoster¹, Bart Kenens¹, Diana Tsvetanova¹, Alfonso Sepulveda Marquez¹, Gayle Murdoch¹, Seongho Park¹, Zsolt Tokei¹ (1. imec (Belgium))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 14:45 〜 15:00 |PDF ダウンロード

[G-1-04] Optimizations on resistivity of binary compounds for advanced interconnect metallization

^○Jean- Philippe Soulie¹, Nancy Heylen¹, Jeroen Scheerder¹, Claudia Fleischmann^1,2, Zsolt Tőkei¹, Christoph Adelmann¹ (1. Inst. IMEC (Belgium), 2. Univ. of Leuven (KUL) (Belgium))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 15:00 〜 15:15 |PDF ダウンロード

[G-1-05] Superconducting Hollow TSV for Quantum Computing

^○Jaber Derakhshandeh¹, Roy Li¹, Geraldine Jamieson¹, Gabriela dos Santos², Bogdan Govoreanu¹, Andy Miller1¹, Eric Beyne¹ (1. IMEC (Belgium), 2. Beneq (Finland))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 15:15 〜 15:30 |PDF ダウンロード

[G-2-01 (Invited)] Strategy of Wafer Bonding Techniques in Commercial MEMS

^○Tadashi Inoue¹ (1. MMI Semiconductor Co., Ltd. (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 16:00 〜 16:30 |PDF ダウンロード

[G-2-02] Design Technique of Serpentine Spring with Half Edge Span Beam Length for High Sensitivity Gold Proof-mass MEMS Capacitive Accelerometer

^○Kisuke Miyado¹, Tenneti Devi Srujana¹, Akira Onishi¹, Katsuyuki Machida¹, Tomoyuki Kurioka¹, Parthojit Chakraborty¹, Tso-Fu Mark Chang¹, Masato Sone¹, Yoshihiro Miyake¹, Hiroyuki Ito¹ (1. Tokyo Institute of Technology (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 16:30 〜 16:45 |PDF ダウンロード

[G-2-03] One-dimensional Hybrid Nanowires Patterning by Interfacial Architectonics for Soft Electronics

^○Lingying Li¹, Wanli Li², Masayuki Kanehara³, Takeo Minari¹ (1. NIMS (Japan), 2. Jiangnan Univ. (China), 3. C-INK Co., Ltd. (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 16:45 〜 17:00 |PDF ダウンロード

[G-2-04] Wafer Reconstitution: embedded multi-die III-V and silicon co-integration platform

^○Gauri Vibhakar Karve¹, Yunlong Li², Vasyl Motsnyi¹, Wei Wei¹, Jakob Visker¹, Francois Chancerel¹, Jan Ackaert¹, Renaud Puybaret¹, Barundeb Dutta¹, Deniz Sabuncuoglu Tezcan¹, Lan Peng¹, Philippe Soussan¹, Simone Severi¹, Haris Osman¹ (1. IMEC (Belgium), 2. Zhejiang University (China))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 17:00 〜 17:15 |PDF ダウンロード

[G-2-05] Propagation Characteristics of AlScN SAW Resonators on Silicon and Al ₂O ₃ Substrates

^○Guofang Yu¹, Renrong Liang¹, Congyi Zhu², Haiming Zhao¹, Jing Wang¹, Jun Fu¹ (1. Tsinghua Univ. (China), 2. Nanjing Univ. of Aero. and Astr. (China))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 17:15 〜 17:30 |PDF ダウンロード

[G-4-01 (Late News)] Moisture Barrier Properties of Microwave Plasma-Enhanced CVD Graphene Using Greenhouse Gases for Cu Metallization

^○Ploybussara Gomasang^1,4, Masayoshi Umeno², Kazuyoshi Ueno^3,4 (1. Dept. of Electrical Eng., Silpakorn Univ. (Thailand), 2. C’s Techno Inc. (Japan), 3. Dept. of Electronic Eng., Shibaura Inst. of Tech. (Japan), 4. Int'l Res. Center for Green Electronics, SIT (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月7日(木) 10:45 〜 11:00 |PDF ダウンロード