[PS-11-20 (Late News)] Optical Property Enhancement through Alloying in High-Speed CWLA-Grown n-type Ge-based MaterialsThe Construction of 4-D FMCW LiDAR Images by Directly Using Self-Heterodyne Beating Signal at Baseband and Linearization of Wavelength Sweeping Lasers

^○Rahmat Hadi Saputro^1,2, Ryo Matsumura¹, Tatsuro Maeda³, Naoki Fukata^1,2Yu-Xiang Lin¹, Zohauddin Ahmad², Huan-Bin Yang², Ke-En Liao², You-Chia Chang³, Chia-Chien Wei¹, ^○Jin-Wei Shi² (1. NIMS (Japan), 2. Univ. of Tsukuba (Japan), 3. AIST (Japan)1.National Sun Yat-sen University (Taiwan), 2. National Central University (Taiwan), 3. National Yang Ming Chiao Tung University (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-12-01] The Construction of 4-D FMCW LiDAR Images by Directly Using Self-Heterodyne Beating Signal at Baseband and Linearization of Wavelength Sweeping Lasers

Yu-Xiang Lin¹, Zohauddin Ahmad², Huan-Bin Yang², Ke-En Liao², You-Chia Chang³, Chia-Chien Wei¹, ^○Jin-Wei Shi² (1. National Sun Yat-sen University (Taiwan), 2. National Central University (Taiwan), 3. National Yang Ming Chiao Tung University (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-12-02] A Reconfigurable Low-Power Current Mode Computing near Sensor Element for Edge Detection

^○Xu Ren¹, Chang Xue¹, Yandong He¹, Gang Du¹ (1. Peking University (China))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-12-03] An Ultra-Low Power Low-Dropout Regulator with a Load Current Tracking Bias Current Generator

^○Yosuke Mizuno¹, Hikaru Sebe¹, Daisuke Kanemoto¹, Tetsuya Hirose¹ (1. Osaka Univ. (Japan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-12-04] A sub-50-mV supply, recursive stacking body bias NAND gate for extremely low-voltage energy harvesting

^○Shintaro Sumi¹, Hikaru Sebe¹, Daisuke Kanemoto¹, Tetsuya Hirose¹ (1. Osaka Univ. (Japan))

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[PS-12-05] A New Equivalent Circuit based Analytical Model for mm-Wave CMOS Inductors Design and Simulation at Various Substrate Resistivities

^○Jyh-Chyurn Guo¹, Teng-Yang Tan¹ (1. National Yang Ming Chiao-Tung University (Taiwan))

2023 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-12-06] Low Quiescent Current Capacitively-coupled Chopper Instrumentation Amplifier in EEG Recording Wearable Devices for Compressed Sensing Framework

^○Kenji Mii¹, Daisuke Kanemoto¹, Tetsuya Hirose¹ (1. Osaka Univ. (Japan))

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[RS] Expectations of semiconductor devices and materials for Automotive applications

^○Kazuoki Matsugatani¹ (1. Denso Corp. (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月7日(木) 17:30 〜 19:30

[SC-A-01] Logic Scaling Trend

〇Yuzo Fukuzaki¹ (1. Rapidus US, Formerly with TechInsights)

2023 International Conference on Solid State Devices and Materials |2023年9月5日(火) 13:00 〜 13:45

[SC-A-02] Chip Design Democratization for Scaled CMOS

〇Makoto Ikeda¹ (1. Univ. of Tokyo)

2023 International Conference on Solid State Devices and Materials |2023年9月5日(火) 13:45 〜 14:30