The Japan Society of Applied Physics

633件中(221 - 230)

[K-1-04] 3D Vertical Poly-Si FeFETs Toward Stackable High-Density Non-volatile Memory Applications

Zhao- Feng Lou1, Zhi-Xian Li2, Fu-Sheng Chang3, Chen-Ying Lin2, Jia-Hong Chen2, Zong-Han Li2, Cheng-Hong Liu1, Tim Chen4, Min-Hung Lee1 (1. Graduate School of Advance Tech., National Taiwan Univ. (Taiwan), 2. Inst. and Undergraduate Program of Electro-Optical Eng., National Taiwan Normal Univ. (Taiwan), 3. Graduate Inst. of Electronics Eng., National Taiwan Univ. (Taiwan), 4. AUCMOS Tech. (United States of America))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 15:00 〜 15:15 |PDF ダウンロード

[K-1-05] Withdrawn

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 15:15 〜 15:30

[K-2-04] Investigation of Spin-on Films as Mold Stack and Controlling Wafer Warpage for 3D Memory Integration

Soodoo Chae1, Hojin Kim1, Nayoung Bae1, Stephen Mancini2, Lior Huli1, Steven Gueci1, Dave Hetzer1, Sitaram Arkalgud1 (1. TEL Technology Center, America, LLC (United States of America), 2. College of Nanoscale Science and Engineering (United States of America))

2023 International Conference on Solid State Devices and Materials |2023年9月6日(水) 16:45 〜 17:00 |PDF ダウンロード

633件中(221 - 230)