[G-4-02] Dielectric Breakdown of Low Temperature Deposited SiCN Layers

Lin Hou¹, Venkat Sunil Kumar Channam², Alicja Lesniewska², Serena Lacovo², Shuo Kang², Joeri De Vos², Anne Jourdain², Gerald Beyer², Kristof Croes², Edward Walsby³, Kath Crook³, Igor Belov³, Yangyin Chen¹, Yan Li¹, Eric Beyne² (1. Western Digital (United States of America), 2. IMEC (Belgium), 3. SPTS (United States of America))

2023 International Conference on Solid State Devices and Materials |2023年9月7日(木) 11:00 〜 11:15 |PDF ダウンロード

[G-4-03] Effects of Tri-Methyl-Aluminum Introduced into Vinylsilane on SiC Thin Film by Using Chemical Vapor Deposition

^○Yuuki Tsuchiizu¹, Kennichi Uehara², Sigeo Yasuhara², Wakana Takeuchi¹ (1. Aichi Inst. of Tech. (Japan), 2. Japan Advanced Chemicals Ltd. (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月7日(木) 11:15 〜 11:30 |PDF ダウンロード

[G-4-04] Electrical Properties of Reactive Sputtered Ti or V - based MAX alloy Thin Films

^○Kazuki Ueda¹, Kazunobu Wakamatsu¹, Takeyasu Saito¹, Naoki Okamoto¹ (1. Osaka Metropolitan University (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月7日(木) 11:30 〜 11:45 |PDF ダウンロード

[G-4-05] Photoelectrical Characterization of Heavily-doped p-SiC Schottky Contacts

^○Hiroki Imabayashi¹, Hitose Sawazaki¹, Haruto Yoshimura¹, Masashi Kato², Kenji Shiojima¹ (1. Univ. of Fukui (Japan), 2. Nagoya Inst. of Tech. (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月7日(木) 11:45 〜 12:00 |PDF ダウンロード

[G-5-01 (Invited)] EMIB and Advanced Substrate Packaging Technologies to Enable Heterogeneous Integration (HI) Applications

^○Gang Duan¹, Ravi Mahajan¹, Rahul Manepalli¹, Hamid Azimi¹ (1. Intel Corp. (United States of America))

2023 International Conference on Solid State Devices and Materials |2023年9月8日(金) 09:00 〜 09:30 |PDF ダウンロード

[G-5-02] High-Bendable 3D Corrugated Interconnections for Chiplet-Embedded Flexible Hybrid Electronics Using Wafer-Level Packaging

^○Chang Liu¹, Tadaaki Hoshi¹, Jiayi Shen¹, Atsushi Shinoda¹, Zehua Du¹, Hisashi Kino^1,2, Tetsu Tanaka^1,2, Takafumi Fukushima^1,2 (1. Graduate School of Eng., Tohoku Univ. (Japan), 2. Graduate School of Biomedical Eng., Tohoku Univ. (Japan))

2023 International Conference on Solid State Devices and Materials |2023年9月8日(金) 09:30 〜 09:45 |PDF ダウンロード

[G-5-03] Damascene Compatible Low Thermal Budget Fine-Pitch Copper Hybrid Boding with Ultra-Thin Surface Passivation

^○Hemanth Kuamr Cheemalamarri¹, Gim Guan Chen¹, Hongyu Li¹, Chandra Rao Bhesetti¹, Nagendra Sekhar Vasarla¹, Nandini Venkataraman¹, King Jien Chui¹, Srinivasa Rao Vempati¹, Navab Singh¹ (1. Institute of Microelectronics, Agency for Science, Technology and Research (A*STAR), Singapore (Singapore))

2023 International Conference on Solid State Devices and Materials |2023年9月8日(金) 09:45 〜 10:00 |PDF ダウンロード

[G-5-04] Middle-End of Line Si FinFETs Using Laser-Liquid-Phase-Epitaxy Technique for Monolithic 3DIC

^○Bo- Jheng Shih^1,2, Yu-Ming Pan¹, Hao-Tung Chung¹, Nei-Chih Lin², Chih-Chao Yang², Po-Tsang Huang¹, Huang-Chung Cheng¹, Chang-Hong Shen², Jia-Min Shieh², Wen-Fa Wu², Kuan-Neng Chen¹, Chenming Hu^1,3 (1. Univ. of Yang Ming Chiao Tung (Taiwan), 2. Inst. of Taiwan Semiconductor Research (Taiwan), 3. Univ. of California, Berkeley (United States of America))

2023 International Conference on Solid State Devices and Materials |2023年9月8日(金) 10:00 〜 10:15 |PDF ダウンロード

[G-6-01 (Invited)] The evolution towards CMOS 2.0, a Heterogeneous Logic Platform

^○Geert Hellings¹, Sheng Yang¹, Pieter Weckx¹, Marie Garcia Bardon¹, Maarten Van de Put¹, Julien Ryckaert¹ (1. imec (Belgium))

2023 International Conference on Solid State Devices and Materials |2023年9月8日(金) 10:45 〜 11:15 |PDF ダウンロード

[G-6-02 (Invited)] Packaging for Heterogeneous Integration: An Equipment Supplier’s Perspective

^○Amulya Athayde¹ (1. Applied Materials, Inc. (United States of America))

2023 International Conference on Solid State Devices and Materials |2023年9月8日(金) 11:15 〜 11:45 |PDF ダウンロード