[D-7-6] X-ray Diffraction Study of Evolution of Polytypes in Au-assisted GaAs Nanowires

^○M. Takahasi^1,2, M. Kozu^1,2, T. Sasaki¹ (1.Japan Atomic Energy Agency, 2.Univ. of Hyogo(Japan))

2015 International Conference on Solid State Devices and Materials |Wed. Sep 30, 2015 12:15 PM - 12:30 PM |PDF Download

[E-1-1] (Invited) Functionalized Insulated Molecular Wires for Molecular Electronics

^○J. Terao (1.Kyoto Univ.(Japan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 2:00 PM - 2:30 PM |PDF Download

[E-1-2] MEMS Ascorbic Acid Fuel Cells with Flexible Electrodes of Enzyme-Coated Graphene Carbon Fiber Cloth

^○K. Hoshi¹, F. Yudai¹, K. Muramatu², H. Sumi², Y. Otani³, D. Kanakura³, Y. Nishioka¹ (1.Nihon Univ., 2.Incubation Alliance, Inc., 3.Inoue Mago Coro. Ltd.(Japan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 2:30 PM - 2:45 PM |PDF Download

[E-1-3] Interfacial Charge Transfer Behaviour of Conducting Polymers as Contact Electrode for Semiconductor Devices

^○J. Kawakita¹, Y. Fujikawa¹, T. Nagata¹, T. Chikyow¹ (1.NIMS(Japan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 2:45 PM - 3:00 PM |PDF Download

[E-1-4] Effect of Current Stress during Thermal CVD of Multilayer Graphene on Cobalt Catalytic Layer

^○H. Ichikawa¹, T. Uchida¹, K. Ueno¹ (1.Shibaura. Inst. of Tech.(Japan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 3:00 PM - 3:15 PM |PDF Download

[E-1-5] Intercalation Doping with Metal Chlorides in Low-Temperature-Grown Multilayer CVD Graphene for Interconnect Applications

^○H. Miyazaki^1,2, R. Matsumoto³, M. Katagiri^1,2, D. Nishide^1,4, R. Ifuku^1,4, M. Takahashi¹, Y. Yamazaki^1,2, T. Matsumoto^1,4, N. Sakuma^1,2, K. Ueno⁵, T. Sakai^1,2, A. Kajita^1,2 (1.LEAP, 2.Toshiba Corp., 3.Tokyo Polytechnic Univ., 4.Tokyo Electron Ltd., 5.Shibaura Inst. of Tech.(Japan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 3:15 PM - 3:30 PM |PDF Download

[E-1-6] Doped Carbon Nanotubes for Interconnects

^○J. Robertson¹, S. Esconjauregui¹, L. D'Arsie¹, J. Yang¹, H. Sugime¹, G. Zhong¹, S. Vollebregt², R. Ishihara², C. Cepek³, G. Duesberg⁴, T. Hallam⁴, Y. Guo¹ (1.Univ. of Cambridge, 2.Delft Univ., 3.TASC, 4.Trinity College Dublin(UK))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 3:30 PM - 3:45 PM |PDF Download

[E-2-1] (Invited) Ultra-Heat Resistant Interconnection for Wide Band Gap Semiconductors

^○K. Suganuma, S. Nagao, T. Sugahara, J. Jiu (1.Osaka Univ.(Japan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 4:05 PM - 4:35 PM |PDF Download

[E-2-2] (Invited) Nanomechanical Characterization of Intermetallic Compounds in Miniaturized Interconnections

^○J. M. Song (1.Natl. Chung Hsing Univ.(Taiwan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 4:35 PM - 5:05 PM |PDF Download

[E-2-3] Wafer Bonding of SiC-SiC and SiC-Si by Modified Suface Activated Bonding Method

^○F. Mu¹, M. Fujino¹, T. Suga¹, K. Iguchi², H. Nakazawa², Y. Takahashi² (1.Univ. of Tokyo, 2.Fuji Electric Co., Ltd.(Japan))

2015 International Conference on Solid State Devices and Materials |Mon. Sep 28, 2015 5:05 PM - 5:25 PM |PDF Download