The Japan Society of Applied Physics

[K-4-3] W and Copper Interconnection Stability for 3D VLSI CoolCube Integration

C. Fenouillet Beranger1, S. Kerdiles1, F. Deprat1,3, P. Batude1, M. P. Samson2,1, B. Previtali1, N. Rambal1,2, V. Lapras1,2, L. Emery2, C. Euvrard Colnat1, A. Seignard1,2, P. Besson2,1, KachtouliR. 1, A. Roman2,1, C. Ribiere1,V. Lu2,1, L. Brunet1, E. Gourvest2, G. Druais2, Y. Loquet2, L. Arnaud1, Y. Le Friec2, O. Pollet1, V. Benevent1, F. Aussenac1, H. Denis1, V. Jousseaume1, S. Maitrejean1, M. Vinet1 (1.CEA-LETI, 2.STMicroelectronics, 3.IMEP(France))

2015 International Conference on Solid State Devices and Materials |Tue. Sep 29, 2015 4:30 PM - 4:50 PM |PDF Download