The Japan Society of Applied Physics

533 results (91 - 100)

[C-6-3] Comparative Studies of Pore Seal Films for Porous-Silica/Cu lnterconnect

Y Shishida, S. Chikaki, M. Shimoyama, R. Yagi, T. Yoshino, T. Ono, A. Ishikawa, N. Fujii, T. Nakayama, K. Kohmura, H. Tanaka, J. Kawahara, Y. Sonoda, H. Matsuo, S. Hishiya, T. Yamanishi, K. Kinoshita, T. Kikkawa (1.MIRAI, Association of Super-Advanced Electronics Technologies(ASET), 2.MIRAI, Advanced Semiconductor Research Center, National Institute of Advanced Industrial Science and Technology, 3.Research Center for Nanodevices and Systems, Hiroshima University)

2005 International Conference on Solid State Devices and Materials |PDF Download

[C-7-2] Highly Thermal Immune Ni GermanoSilicide with Nitrogen-Doped Ni and Co/TiN Double Capping Layer for Nano-Scale CMOS Applications

Soon-Young Oh, Jang-Gn Yun, Yong-Jin Kim, Won-Jae Lee, Hee-Hwan Ji, Tuya Agchbayar, Ui-Sik Kim, Han-Seob Cha, Sang-Bum Heo, Yoo-Jeong Cho, Kil-Jin Han, Yeong-Cheul Kim, Jin-Suk Wang, Hi-Deok Lee (1.Dept. of Electronics Engineering, Chungnam National University, 2.R&D Center, MagnaChip Semiconductor Ltd., 3.Dept. Of Materials Engineering, Korea University of Technology and Education)

2005 International Conference on Solid State Devices and Materials |PDF Download

533 results (91 - 100)