[C-2-1] Low Temperature Processes using Ni-induced Crystallization Technique for Monolithic Three Dimensional Integration

J. H. Park¹、M. Tada^1,2、H. Peng¹、K. C. Saraswat¹ (1.Stanford Univ., USA、2.NEC Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-2-2] Narrow Trench Filled Source/Drain Contact for 3D MOSFET

H. B. Lee¹、S. H. Ahn¹、B. G. Kim¹、W. C. Choi¹、J. H. Jung¹、J. H. Lee¹、S. H. Hahm¹ (1.Kyungpook National Univ., Korea)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

H. Nagase¹、A. Tanabe¹、K. Umeda¹、T. Watanabe¹、Y. Hayashi¹ (1.NEC Electronics Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

H. Aoki¹、D. Watanabe¹、N. Ooi¹、J. Jong-Hyeon¹、C. Kimura¹、T. Sugino¹ (1.Osaka Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

M. Imai¹、Y. Yamashita²、T. Futatsuki²、M. Shiohara¹、S. Kondo¹、S. Saito¹ (1.Selete、2.Organo Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

M. Hara¹、D. Watanabe¹、C. Kimura¹、H. Aoki¹、T. Sugino¹ (1.Osaka Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

Y. Ando¹、K. Kasahara¹、K. Ueda¹、K. Hamaya¹、Y. Nozaki¹、T. Sadoh¹、Y. Maeda²、K. Matsuyama¹、M. Miyao¹ (1.Kyushu Univ.、2.Kyoto Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

S. Yada¹、S. Sugahara²、M. Tanaka¹ (1.Univ. of Tokyo、2.Tokyo Tech., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

P. N. Hai¹、B. Yu¹、S. Ohya^1,2、M. Tanaka^1,2 (1.Univ. of Tokyo、2.JST, Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

Y. Gyoda¹、J. Hayafuji¹、M. Yarimizu¹、W. Terui¹、S. Sugahara¹、H. Munekata¹ (1.Tokyo Tech., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

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