[C-9-4] Materials Engineering for Future Interconnects: "Catalyst-free" Electroless Cu Deposition on Self-assembly Monolayer Alternative Barriers
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
587件中(111 - 120)
[C-9-5] Kinetics of Self-Formation of Ti-based Barrier Layers in Cu(Ti)/Dielectric-Layer Samples
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[C-10-1] Galvanic Corrosion Control during Cu Chemical Mechanical Polishing of Cu Interconnects that Contain Ruthenium Barrier Metal Film
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[C-10-2] FDC and APC System Approach to Stabilize Cu CMP Process in Mass Production Line (Invited)
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[C-10-3] Defect-less Monolithic Low-k/Cu Interconnects by Chemistry-controlled CMP
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-1-1] Millimeter-Wave CMOS Pulse Communication (Invited)
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-1-2] Characteristics of Si On-chip Integrated Antennas Fabricated on Dielectric Substrates
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-1-3] A 2-GHz-band CMOS Low Noise Amplifier with High-Q Inductors Embedded in Wafer-Level Package
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-1-4] A High IIP3 Image Rejection Filter with Current Adapted Buffers for a Digital/Analog TV Tuner IC in a 0.25 μm RF-CMOS Technology
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-1-5] A 10 Gbit/s Optical Receiver Analog Front-End with Input Parasitic Capacitance Immunization Technique
2008 International Conference on Solid State Devices and Materials |PDF ダウンロード