[C-7-2] An Efficient Modeling Technique with Q-curve Analytic for Design Automation

C. Y. Lee¹、S. C. Chang¹、J. D. S. Deng²、C. H. Kao¹ (1.National Defense Univ.、2.Cyntec Co., Ltd., Taiwan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-7-3] High-frequency Magnetic Shielding Technology for Electronic Devices (Invited)

M. Yamaguchi¹、Y. Endo¹、Y. Shimada¹ (1.Tohoku Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-7-4] Enhanced Power Supply Structure with New Mesh Wiring and Electroless Plated Shunt Line and Assembly-Stress-Relaxation Structure

Y. Ota¹、K. Ishikawa¹、F. Itoh¹、Y. Itoh¹、C. Karatani¹、K. Koike¹、T. Nishio¹、M. Takahashi¹、H. Hirano¹ (1.Matsushita Electric Industrial Co., Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-1] Effect of NH₃-Free Silicon Nitride for Protection Layer of Magnetic Tunnel Junction on Magnetic Properties of Magnetoresistive Random Access Memory

T. Murata¹、Y. Miyagawa¹、R. Matsuda¹、M. Tsujiuchi¹、S. Ueno¹、Y. Takeuchi¹、M. Matsuura¹、K. Asai¹ (1.Renesas Tech. Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-2] Resistive Switching Memory using High-κ Ta₂O₅ Films

Y. R. Tsai¹、S. Maikap¹、D. Panda¹、S. Z. Rahaman¹、C. S. Lai¹、P. J. Tzeng²、C. H. Lin²、T. C. Tien²、T. Y. Wu²、C. C. Wang²、M. J. Kao²、M. J. Tsai² (1.Chang Gung Univ.、2.Industrial Tech. Res. Inst., Taiwan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-3] Development of Multi-Scale Electromigration Simulator using Ultra Accelerated Quantum Chemical Molecular Dynamics and a Kinetic Monte Carlo Method and its Application to Cu Interconnect

H. Tsuboi¹、A. Chutia¹、C. Lv¹、Z. Zhu¹、R. Miura¹、A. Suzuki¹、R. Sahnoun¹、M. Koyama¹、N. Hatakeyama¹、A. Endou¹、H. Takaba¹、C. A. Del Carpio¹、R. C. Deka²、M. Kubo¹、A. Miyamoto¹ (1.Tohoku Univ., Japan、2.Tezpur Univ., India)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-4] Interconnect and Packaging Technology for CMOS Image Sensors (Invited)

J. Gambino¹、B. Leidy¹、R. J. Rassel¹、J. Adkisson¹、J. Ellis-Monaghan¹、C. Musante¹、K. Ackerson¹、B. Guthrie¹、W. Abadeer¹、D. Meatyard¹、S. Mongeon¹、M. Jaffe¹ (1.IBM, USA)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-9-1] Influence of Ti Liner on Resistivity of Copper Interconnects

H. Kitada¹、T. Suzuki¹、S. Akiyama²、T. Nakamura¹ (1.Fujitsu Labs. Ltd.、2.Fujitsu Microelectronics Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-9-2] Effects of Pre- and Post-treatment of TaN Barrier Metal Deposited by Plasma Enhanced Atomic Layer Deposition (PEALD) Method on Electromigration Resistance in Cu Interconnect

H. C. Lee¹、M. H. Lee¹、B. H. Lee¹、S. C. Kim¹、J. Y. Yang¹、I. Hwangbo¹、J. W. Han¹、K. J. Choi²、K. H. Lee²、J. H. Jeong² (1.Dongbu HiTek Semiconductor Business、2.QUROS Co., Ltd., Korea)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-9-3] Metal Resistivity in Narrow Interconnect Lines (Invited)

S. Maitrejean¹、V. Carreau¹ (1.CEA-LETI/MINATEC, France)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード