587件中(71 - 80)

[B-10-1] Accuracy Assessment of Charge-Based Capacitance Measurement for Nanoscale MOSFET Devices

H. Zhao^1,2、S. C. Rustagi¹、F. Ma^1,2、G. S. Samudra²、N. Singh¹、G. Q. Lo¹、D. L. Kwong¹ (1.Inst. of Microelectronics、2.National Univ. of Singapore, Singapore)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[B-10-2] Anomalous RTS Extractions from a Very Large Number of n-MOSFETs using TEG with 0.47 Hz - 3.0 MHz Sampling Frequency

K. Abe¹、T. Fujisawa¹、A. Teramoto¹、S. Watabe¹、S. Sugawa¹、T. Ohmi¹ (1.Tohoku Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[B-10-3] Accurate Channel Thermal Noise Modeling in BSIM4

J. Jeon¹、J. Lee¹、C. H. Park²、J. S. Yoon³、H. Lee³、H. Oh³、B. G. Park¹、H. Shin¹ (1.Seoul National Univ.、2.Kwangwoon Univ.、3.Samsung Electronics Co., Ltd., Korea)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[B-10-4] Impacts of Random Dopant Fluctuation on Transient Characteristics in CMOS Inverters: A Device Simulation Study

S. Toriyama¹、K. Matsuzawa¹、N. Sano² (1.Toshiba Corp.、2.Univ. of Tsukuba, Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[B-10-5] Discrete Dopant Fluctuated Transient Behavior in 16-nm-Gate CMOS

Y. Li¹、C. H. Hwang¹、T. C. Yeh¹、H. W. Cheng¹、T. Y. Li¹ (1.National Chiao Tung Univ., Taiwan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-1-1] Plastic Material Solutions for Advanced Thin Packages (Invited)

H. Tanaka¹ (1.Sumitomo Bakelite Co., Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-1-2] 3D-Stacking Process for Si Interposer with Integrated Thin-film Capacitors

A. Shibuya¹、A. Ohuchi¹、K. Takemura¹ (1.NEC Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-1-3] A New Scaled Through Si Via with Polymer Fill for 3D Wafer Level Packaging

D. S. Tezcan¹、F. Duval¹、O. Luhn¹、P. Soussan¹、B. Swinnen¹ (1.IMEC, Belgium)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-1-4] Aberration Corrected Microscopy and Spectroscopy for Pico-meter Characterization of Device Materials - Coductance Quantization of Metal Nanowire and AtomicChain - (Invited)

K. Takayanagi¹、Y. Kurui¹、Y. Ohshima¹、Y. Tanishiro¹ (1.Tokyo Tech., Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-1-5] In Situ High-resolution Transmission Electron Microscopy of Electromigration in Nanometer-sized Copper Contacts

H. Aoki¹、T. Kizuka¹ (1.Univ. of Tsukuba, Japan)

2008 International Conference on Solid State Devices and Materials |PDF ダウンロード

587件中(71 - 80)