[G-5-3] Evaluation of Hot-Carrier Hardness and Thick-Film Formation with STP Technique for Seamless Integration Technology

N. Sato, N. Shimoyama, T. Kamei, K. Kudou, M. Yano, H. Ishii, K. Machida (1.NTT Microsystem Integration Laboratories, NTT Corporation, 2.NTT Advanced Technology Corporation)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-5-4] New Process of Self-organized Interconnection in Packaging by Conductive Adhesive with Low Melting Point Filler

Kiyokazu Yasuda, Jong-Min Kim, Masahiro Yasuda, Kozo Fujimoto (1.Osaka Univ., Graduate School of Eng., Dept. of Manufacturing Science)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-6-1] AC Coupled Interconnect for High-Density High-Bandwidth Packaging

Paul Franzon, Stephen Mick, John Wilson, Lei Luo, Karthik Chandrasakhar (1.Department of Electrical and Computer Engineering, NC State University)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-6-2] Inter-chip Wireless Interconnection using Si Integrated Antenna

A.B.M. H. Rashid, S. Watanabe, T. Kikkawa (1.Research Center for Nanodevices and Systems, Hiroshima University)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-6-3] Magnetic Near-Field Mappings over Fine Circuits by Fiber-Edge Magneto-Optic Probe

Mizuki Iwanami, Shigeki Hoshino, Masato Kishi, Masahiro Tsuchiya (1.Association of Super-Advanced Electronics Technologies, 2.Department of Electronic Engineering, the University of Tokyo)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-6-4] Variable RF Inductor on Si CMOS Chip

Shinichiro Gomi, Yoshisato Yokoyama, Hirotaka Sugawara, Hiroyuki Ito, Kenichi Okada, Hiroaki Hoshino, Hidetoshi Onodera, Kazuya Masu (1.Precision and Intelligence Laboratory, Tokyo Institute of Technology, 2.Dept. of Communications and Computer Engineering, Kyoto University)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-7-1] Over 65% Efficiency 300MHz Bandwidth C-Band Internally-Matched GaAs FET

Hiroshi Ohtsuka, Kazutomi Mori, Hidenori Yukawa, Hiroaki Minamide, Yoshinori Kittaka, Toshiyasu Tsunoda, Satoshi Ogura, Tadashi Takagi (1.Mitsubishi Electric Corporation, Information Technology R&D Center, 2.Mitsubishi Electric Corporation, High Frequency & Optical Semiconductor Div., 3.Mitsubishi Electric Corporation, Kamakura Works)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-7-2] High-Performance InP HBTs with a Composite Collector

Kenji Kurishima, Minoru Ida, Kiyoshi Ishii, Noriyuki Watanabe (1.NTT Photonics Laboratories, NTT Corporation)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-7-3] A High Reliability and High Gain InP-HEMT with Composite Channel Structure

Shunsuke Kurachi, Yasunori Nonaka, Jun-ichiro Nikaido (1.Fujitsu Quantum Devices Limited)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-7-4] 75-GHz Optical Clock Divide-by-Two OEIC using InP HEMTs and Uni-Traveling-Carrier Photodiode

Kimikazu Sano, Koichi Murata, Hideaki Matsuzaki, Hiroto Kitabayashi, Tomoyuki Akeyoshi, Hiroshi Ito, Takatomo Enoki, Hirohiko Sugahara (1.NTT Photonics Laboratories, NTT Corporation)

2003 International Conference on Solid State Devices and Materials |PDF Download

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