[G-3-1] The challenge of analog mix-mode integrated circuit design for brain computer interface

Zhihua Wang, Chun Zhang, Dongmei Li (1.Department of Electronic Engineering, Tsinghua Uinversity)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-3-2] The Vision Chip with Electrical Fovea Motion

Yoshihiro Nakagawa, Jun Deguchi, Shim Jeoung-Chill, Hiroyuki Kurino, Mitsumasa Koyanagi (1.Tohoku Univ., Graduate School of Eng., Dept. of Bioengineering and Robotics)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-3-3] A Periodic Comparator Operating at 80GHz Based on Single-Flux-Quantum Technology with High Temperature Superconductor

Hideyuki Sugiyama, Hironori Wakana, Seiji Adachi, Yoshinobu Tarutani, Keiichi Tanabe (1.Corporate Research and Development Center, Toshiba Corporation, 2.Superconductivity Research Laboratory)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-3-4] Ultra Small Random Number Generating Circuits With A Novel Noise Source Device

Shinichi Yasuda, Hideki Satake, Hanae Nozaki, Tetsufumi Tanamoto, Ryuji Ohba, Ken Uchida, Atsuhiro Kinoshita, Shinobu Fujita (1.Advanced LSI Technology Laboratory, Corporate Research & Development Center, Toshiba Corporation, 2.Computer & Network Systems Laboratory, Corporate Research & Development Center, Toshiba Corporation)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-4-1] 3D System Integration by Chip-to-Wafer Stacking Technologies

Peter Ramm, Armin Klumpp, Reinhard Merkel, Josef Weber, Robert Wieland, Gunter Elst (1.Fraunhofer Institute for Reliability and Microintegration, Munich Division, 2.Fraunhofer Institute for Integrated Circuits, Dresden Division)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-4-2] Micro Cu Bump Interconnection on 3D Chip Stacking Technology

Kazumasa Tanida, Mitsuo Umemoto, Naotaka Tanaka, Yoshihiro Tomita, Kenji Takahashi (1.Association of Super -Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-4-3] Copper Electrodeposition of High-Aspect-Ratio Vias for Three Dimensional Packaging

Kazuo Kondo, Toshihiro Yonezawa, Manabu Tomisaka, Hitoshi Yonemura, Masataka Hoshino, Yuichi Taguchi, Kenji Takahashi (1.Department of Applied Chemistry,Okayama University, 2.Tsukuba Research Center, Electronic System Integration Technology Research Department, ASET)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-4-4L] Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide

Katsuya Kikuchi, Shigemasa Segawa, Eun-Sil Jung, Yoshihiko Nemoto, Hiroshi Nakagawa, Kazuhiko Tokoro, Masahiro Aoyagi (1.National Institute of Advanced Industrial Science and Technology (AIST), 2.PI Research and Development Co., Ltd., 3.Electronic System Integration Technology Research Development, Association of Super-Advanced Electronics Technologies (ASET))

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-5-1] Design, Manufacturing and Infrastructure for All-in-One SiP Solution

Takao Fujitsu, Takashi Katsumata, Hitoshi Kawaguchi (1.J-SiP Wolton Corp., 2.Sumitomo Bakelite Co.,Ltd. Electric Device Materials Research Lab.Ⅲ)

2003 International Conference on Solid State Devices and Materials |PDF Download

[G-5-2] System Packaging and Embedded WLP Technologies for Mobile Products

Takeshi Wakabayashi (1.Advanced Packaging Technology Dep., Core Technologies R&D Division, CASIO COMPUTER CO., LTD.)

2003 International Conference on Solid State Devices and Materials |PDF Download