[C-7-2] An Efficient Modeling Technique with Q-curve Analytic for Design Automation

C. Y. Lee¹, S. C. Chang¹, J. D. S. Deng², C. H. Kao¹ (1.National Defense Univ., 2.Cyntec Co., Ltd., Taiwan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-7-3] High-frequency Magnetic Shielding Technology for Electronic Devices (Invited)

M. Yamaguchi¹, Y. Endo¹, Y. Shimada¹ (1.Tohoku Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-7-4] Enhanced Power Supply Structure with New Mesh Wiring and Electroless Plated Shunt Line and Assembly-Stress-Relaxation Structure

Y. Ota¹, K. Ishikawa¹, F. Itoh¹, Y. Itoh¹, C. Karatani¹, K. Koike¹, T. Nishio¹, M. Takahashi¹, H. Hirano¹ (1.Matsushita Electric Industrial Co., Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-8-1] Effect of NH₃-Free Silicon Nitride for Protection Layer of Magnetic Tunnel Junction on Magnetic Properties of Magnetoresistive Random Access Memory

T. Murata¹, Y. Miyagawa¹, R. Matsuda¹, M. Tsujiuchi¹, S. Ueno¹, Y. Takeuchi¹, M. Matsuura¹, K. Asai¹ (1.Renesas Tech. Corp., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-8-2] Resistive Switching Memory using High-κ Ta₂O₅ Films

Y. R. Tsai¹, S. Maikap¹, D. Panda¹, S. Z. Rahaman¹, C. S. Lai¹, P. J. Tzeng², C. H. Lin², T. C. Tien², T. Y. Wu², C. C. Wang², M. J. Kao², M. J. Tsai² (1.Chang Gung Univ., 2.Industrial Tech. Res. Inst., Taiwan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-8-3] Development of Multi-Scale Electromigration Simulator using Ultra Accelerated Quantum Chemical Molecular Dynamics and a Kinetic Monte Carlo Method and its Application to Cu Interconnect

H. Tsuboi¹, A. Chutia¹, C. Lv¹, Z. Zhu¹, R. Miura¹, A. Suzuki¹, R. Sahnoun¹, M. Koyama¹, N. Hatakeyama¹, A. Endou¹, H. Takaba¹, C. A. Del Carpio¹, R. C. Deka², M. Kubo¹, A. Miyamoto¹ (1.Tohoku Univ., Japan, 2.Tezpur Univ., India)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-8-4] Interconnect and Packaging Technology for CMOS Image Sensors (Invited)

J. Gambino¹, B. Leidy¹, R. J. Rassel¹, J. Adkisson¹, J. Ellis-Monaghan¹, C. Musante¹, K. Ackerson¹, B. Guthrie¹, W. Abadeer¹, D. Meatyard¹, S. Mongeon¹, M. Jaffe¹ (1.IBM, USA)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-9-1] Influence of Ti Liner on Resistivity of Copper Interconnects

H. Kitada¹, T. Suzuki¹, S. Akiyama², T. Nakamura¹ (1.Fujitsu Labs. Ltd., 2.Fujitsu Microelectronics Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-9-2] Effects of Pre- and Post-treatment of TaN Barrier Metal Deposited by Plasma Enhanced Atomic Layer Deposition (PEALD) Method on Electromigration Resistance in Cu Interconnect

H. C. Lee¹, M. H. Lee¹, B. H. Lee¹, S. C. Kim¹, J. Y. Yang¹, I. Hwangbo¹, J. W. Han¹, K. J. Choi², K. H. Lee², J. H. Jeong² (1.Dongbu HiTek Semiconductor Business, 2.QUROS Co., Ltd., Korea)

2008 International Conference on Solid State Devices and Materials |PDF Download

[C-9-3] Metal Resistivity in Narrow Interconnect Lines (Invited)

S. Maitrejean¹, V. Carreau¹ (1.CEA-LETI/MINATEC, France)

2008 International Conference on Solid State Devices and Materials |PDF Download