[P-1-21L] Characterization of Strain Relaxation Process during Ge Condensation by Synchrotron Microbeam X-ray Diffraction

T. Inoue¹, D. Shimokawa¹, T. Hosoi¹, T. Shimura¹, Y. Imai², O. Sakata², S. Kimura², H. Watanabe¹ (1.Osaka Univ., 2.JASRI, Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-1] Stress Depth Profiling of Silicon from Nickel / Silicon Interface before and after Silicide Formation using Polychromator-based Multi-wavelength Raman Spectroscopy

W. S. Yoo¹, T. Ueda¹, K. Kang¹ (1.WaferMasters, Inc., USA)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-2] Raman Spectroscopic Stress Analysis of Single Crystal Silicon (001) Specimen Tensioned Along the [100] Direction over 1000 MPa

M. Komatsubara¹, Y. Nagai¹, T. Namazu¹, N. Naka², S. Kashiwagi², K. Ohtsuki², S. Inoue¹ (1.Univ. of Hyogo, 2.HORIBA, Ltd., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-3] Direct Observation of Tensile Stress in Silicon Oxide Films using Cathodoluminescence Spectroscopy

S. Kakinuma¹, K. Nishikata¹, N. Yamashita², N. Naka¹, S. Kashiwagi¹, K. Matsumoto¹, T. Namazu², S. Inoue² (1.HORIBA, Ltd., 2.Univ. of Hyogo, Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-4] Si-H Group Elimination Effect on the Properties of SiOCH Films: Theoretical Investigation

N. Tajima¹, M. Shinriki², Y. Xu³, T. Ohno¹ (1.NIMS, 2.Taiyo Nippon Sanso Corp., 3.Tri Chemical Labs. Inc., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-5] A Molecular Dynamics Method for Atomic Models for Amorphous Material: an Example with SiO₂

M. Gao¹, J. Zhang¹, J. Lu¹, Y. Wang¹, Z. Yu¹ (1.Tsinghua Univ., China)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-6] Vapor Phase Silylation Hardening Process for Porous Silica Low-k Films

Y. Nakata¹, Y. Kayaba¹, T. Hirota², T. Kikkawa¹ (1.Hiroshima Univ., 2.TAZMO, Inc., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-7] Cu Electroplating Process with Magnetic Field for Flexible Device

N. Ooi¹, H. Aoki¹, D. Watanabe¹, J. Jong-Hyeon¹, C. Kimura¹, T. Sugino¹ (1.Osaka Univ., Japan)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-8] Copper Plug Barrier Process Optimization for Reliable Transistor Performance

S. K. Manhas¹, M. Chen¹, K. D. Buddharaju¹, H. Y. Li¹, R. Murthy¹, S. Balakumar¹, N. Singh¹, G. Q. Lo¹, D. L. Kwong¹ (1.Inst. of Microelectronics, Singapore)

2008 International Conference on Solid State Devices and Materials |PDF Download

[P-2-9] Experiments and Simulation of Stress Induced Voiding Dependence on Upper Metal Cap Layer in Cu/Low K Interconnects

M. Lin¹, J. W. Liang¹, K. C. Su¹ (1.UMC, Taiwan)

2008 International Conference on Solid State Devices and Materials |PDF Download

587 results (431 - 440)

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