[P-2-2] Improvement of Cu seedless Ru barrier by insertion of an amorphous WCoCN interlayer

J. B. Yeh¹、D. C. Perng¹、K. C. Hsu¹ (1.National Cheng Kung Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-3] Suppression of Fluorine Diffusion into Low-k Material (Methyl-BCN) using Low Temperature Etching

M. Hara¹、T. Masuzumi¹、L. Zhiming¹、C. Kimura¹、H. Aoki¹、T. Sugino¹ (1.Osaka Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-4] Novel Particle Reduction System in Chemical-Vapor-Deposition Process of Interlayer Dielectrics

M. Sato¹、H. Ohtake¹、S. Samukawa¹ (1.Tohoku Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-5] Prediction of UV/VUV Irradiation Damage of Interlayer Dielectrics in Plasma Etching using on-wafer Monitoring Technique

B. Jinnai¹、S. Fukuda¹、H. Ohtake¹、S. Yasuhara²、E. A. Hudson³、S. Samukawa¹ (1.Tohoku Univ.(Japan)、2.Japan Advanced Chemicals(Japan)、3.Lam Res. Corp.(USA))

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-6] Low-Temperature Silicon Oxide Offset Spacer using Plasma Enhanced Atomic Layer Deposition for High-k/Metal Gate Transistor

T. Murata¹、Y. Miyagawa¹、Y. Nishida¹、Y. Yamamoto¹、T. Yamashita¹、M. Matsuura¹、K. Asai¹ (1.Renesas Tech. Corp.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-7] Impact of film structures on damage to low-k SiOCH film during plasma exposure

S. Yasuhara¹、T. Sasaki¹、K. Tajima²、H. Yano²、S. Kadomura²、M. Yoshimaru²、N. Matsunaga²、S. Samukawa¹ (1.Tohoku Univ.(Japan)、2.STARC(Japan))

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-8] Raman Spectroscopic Metrology for Stress measurement in Semiconductor Device Development and Process

N. Naka¹、S. Kashiwagi¹、K. Ohtsuki¹、J. H. Kim²、C. H. Lee²、S. T. Ahn²、K. H. Bae²、H. W. Yoo²、C. H. Kim² (1.HORIBA, Ltd.(Japan)、2.Hynix Semiconductor Inc.(Korea))

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-9] Uniaxial Tensile Testing System for Quantitative Stress Analysis in Silicon Oxide Thin Films by Cathodoluminescence Spectroscopy

N. Goami¹、N. Yamashita¹、N. Araki¹、S. Kakinuma²、K. Nishikata²、N. Naka²、K. Matsumoto²、T. Namazu¹、S. Inoue¹ (1.Univ. of Hyogo(Japan)、2.HORIBA Ltd.(Japan))

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-10] Liquid Phase Bonding using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection

L. J. Qiu¹、N. Watanabe¹、T. Asano¹ (1.Kyushu Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-11] Room-Temperature Large-Number Inter-Chip Connections using Mechanical Caulking Effect of Compliant Bump

N. Watanabe¹、T. Asano¹ (1.Kyushu Univ.)

2009 International Conference on Solid State Devices and Materials |PDF ダウンロード

707件中(501 - 510)

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