[G-7-3] Micro-Texture Dependence of Mechanical Properties of Fine Metallic Bumps Used for Three-Dimensional Electronic Packaging

K. Suzuki¹, R. Furuya¹, F. Endo¹, H. Miura¹ (1.Tohoku Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[G-8-1] Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization

T. Fukushima¹, M. Murugesan¹, J. Bea¹, K.W. Lee¹, M. Koyanagi¹ (1.Tohoku Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[G-8-2] Electromigration effect on mechanical shock behavior of Sn-Ag-Bi-In + Co solder joints for surface-mounted chip components

Y. Kim¹, S. Nagao¹, T. Sugahara¹, K. Suganuma¹ (1.Osaka Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[G-8-3] Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding

Y.J. Chang¹, C.T. Ko^1,2, Z.C. Hsiao², H.C. Fu², T.H. Yu¹, W.C. Lo², K.N. Chen¹ (1.Department of Electronics Engineering, National Chiao Tung Univ., 2.Electronics and Optoelectronics Research Laboratories, ITRI (Taiwan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[H-1-1] Ultra-high Speed Image Sensors for Scientific Imaging

R. Kuroda¹, Y. Tochigi¹, K. Miyauchi¹, T. Takeda¹, R. Hirose², H. Tominaga², K. Takubo², Y. Kondo², S. Sugawa¹ (1.Tohoku Univ., 2.Shimadzu Corp. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[H-1-2] A CMOS Image Sensor Using Column-Parallel Forward Noise-Canceling Circuitry

T.L. Li¹, S. Wakashima¹, Y. Goda¹, R. Kuroda¹, S. Sugawa¹ (1.Univ. of Tohoku (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[H-1-3] A CMOS Image Sensor with High-speed Pixel-parallel Pipelined Readout Channels for Multi-point Fluorescence Correlation Spectroscopy

K. Kagawa¹, T. Takasawa¹, Z. Bo¹, M.W. Seo¹, K. Imai¹, J. Yamamoto², M. Kinjo², K. Yasutomi¹, S. Terakawa³, S. Kawahito¹ (1.Shizuoka Univ., 2.Hokkaido Univ., 3.Hamamatsu Univ. School of Medicine (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[H-1-4] A Wide Dynamic Range CMOS Image Sensor with 200-1100 nm Spectral Sensitivity and High Robustness to Ultraviolet Light Exposure

S. Nasuno¹, S. Kawada¹, Y. Koda¹, T. Nakazawa¹, K. Hanzawa¹, R. Kuroda¹, S. Sugawa¹ (1.Univ. of Tohoku (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[H-1-5] A High-Sensitivity Low Dark Current 1.75T/Pixel CMOS Image Sensor with Ring-Gate Shared-Pixel Design

M.W. Seo¹, K. Yasutomi¹, K. Kagawa¹, S. Kawahito¹ (1.Shizuoka Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

[H-2-1] A 0-27 GHz -30 dB Isolation Tx/Rx Single Pole Double Throw (SPDT) Switch for Gaussian Monocycle Pulse Transmission

A. Azhari¹, K Sogo¹, M. Wang¹, A. Toya¹, T. Kikkawa¹ (1.Hiroshima Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF Download

617 results (171 - 180)

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