[PL-1] WebTop Collaboration and Semiconductor Industry

S. Kohyama (1.Toshiba)

2001 International Conference on Solid State Devices and Materials |PDF Download

[PL-2] Prospects of Si ULSI Devices for the Next Ten Years

Yuan Taur (1.IBM T. J. Watson Research Center)

2001 International Conference on Solid State Devices and Materials |PDF Download

[PL-3] Nanotechnology Strategy and Grand Challenges in U.S

M. C. Roco (1.U. S. National Science and Technology Council's subcommittee on Nanoscale Science, Engineering and Technology (NSET), 2.Nanotechnology, National Science Foundation)

2001 International Conference on Solid State Devices and Materials |PDF Download

[A-1-1] Recent Progress in High-k Dielectric Films for ULSIs

Sang In Lee (1.Semiconductor R&D Division, Samsung Electronics Co., Ltd.)

2001 International Conference on Solid State Devices and Materials |PDF Download

[A-1-2] Periodic Mesoporous Silicate Glass as Low-k Thin Film

Yoshiaki Oku, Akira Kamisawa, Norikazu Nishiyama, Korekazu Ueyama (1.Process Technology Div., Semiconductor Research and Development Headquarters, ROHM CO., Ltd., 2.Osaka University, Graduate School of Engineering Science)

2001 International Conference on Solid State Devices and Materials |PDF Download

[A-1-3] Global Planarization with Viscosity Control for an Advanced STP Process

N. Sato, K. Machida, M. Yano, K. Kudou, H. Kyuragi (1.NTT Telecommunications Energy Laboratories, NTT Advanced Technology Corporation)

2001 International Conference on Solid State Devices and Materials |PDF Download

[A-1-4] Dishing-Free Cu Chemical Mechanical Polishing Process Based on Endpoint Detection with Laser Beam

Y. Tokuyama, H. Ogawa, M. Yanagisawa, J. Kikuchi, H. Nakagawa, Y. Horiike (1.Department of Materials Science, School of Engineering, The University of Tokyo, 2.Speedfam Co., Ltd., 3.Axiomatec Inc., 4.Semiconductor Company, Matsushita Electric Industrial Co., Ltd)

2001 International Conference on Solid State Devices and Materials |PDF Download

[A-1-5] CMP Using Fixed Abrasive Tool (FX-CMP) for Dielectric Planarization

S. Katagiri, K. Yasui, Y. Kawamura, U. Yamaguchi, M. Nagasawa, F. Kanai, R. Kawai, M. Tokuda, S. Moriyama, N. Yamada (1.Central Research Laboratory, Hitachi, Ltd., 2.Semiconductor & Integrated circuits, Hitachi, Ltd., 3.Manufacturing Engineering & Environmental Policy Department, Hitachi, Ltd., 4.Instruments, Hitachi, Ltd., 5.Institute of Technologists, 6.Nihon Tokushu Kento co., Ltd.)

2001 International Conference on Solid State Devices and Materials |PDF Download

[A-1-6] A Study on Reclaimed Photoresist Developer Using an Electrodialysis Method

Hiroshi Sugawara, Yoshinori Tajima, Tadahiro Ohmi (1.Department of Electronic Engineering, Graduate School of Engineering, Tohoku University, 2.Organo Corporation, 3.New Industry Creation Hatchery Center, Tohoku University)

2001 International Conference on Solid State Devices and Materials |PDF Download

[A-2-1] Ruthenium Film Etching and Cleaning Process Using Cerium Ammonium Nitrate (CAN)-Nitric Acid

H. Aoki, K. Watanabe, T. Iizuka, N. Ishikawa, K. Mori (1.ULSI Device Development Division, NEC Corporation, 2.Central Research Laboratory, KANTO CHEMICAL CO., INC.)

2001 International Conference on Solid State Devices and Materials |PDF Download