[B-1-4] Feasibility of Direct Bonding Between CMP-Cu Films at Room Temperature for Bumpless Interconnect

Akitsu Shigetou, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga (1.Research Center for Advanced Science and Technology, The University of Tokyo)

2001 International Conference on Solid State Devices and Materials |PDF Download

[B-1-5] New Plasma Surface Treatment for Wire Bonding Process -Effect of Sublimation with Alkyl Group Radicals-

Kazuhiro Honsho, Hirokazu Terai, Hiroshi Yamazoe, Toshiaki Tatsuta, Osamu Tsuji (1.Samco International Inc.)

2001 International Conference on Solid State Devices and Materials |PDF Download

[B-1-6] Oxygen Plasma Activated Silicon Direct Bonding in PECVD Mode

T. H. Kim, M. M. R. Howlader, T. Itoh, T. Suga (1.Research Center for Advanced Science and Technology (RCAST), The University of Tokyo)

2001 International Conference on Solid State Devices and Materials |PDF Download

[B-1-7] Influence on Electrical Characteristic of Direct Au-Bumping on MOSFET

Naoya Watanabe, Tanemasa Asano (1.Center for Microelectronic Systems, Kyushu Institute of Technology)

2001 International Conference on Solid State Devices and Materials |PDF Download

[B-2-1] Recent Advances in SOP Integration

Venky Sundaram, Sidharth Dalmia, Joseph Hobbs, Swapan Bhattacharya, Madhavan Swaminathan, George White, Rao Tummala (1.School of Electrical & Computer Engineering, Packaging Research Center, Georgia Institute of Technology)

2001 International Conference on Solid State Devices and Materials |PDF Download

[B-2-2] Interconnect Length Distribution in Si System ULSI

Naohiro Takagi, Hiyouko Shinoki, Tomohito Tsushima, Yoshisato Yokoyama, Kazuya Masu (1.Precision and Intelligence Laboratory, Tokyo Institute of Technology)

2001 International Conference on Solid State Devices and Materials |PDF Download

[B-2-3] Effects of On-Chip Capacitor on Switching Noise and Radiated Emission

Toshio Sudo, Ken Nakano, Junichi Kudo, Satoru Haga (1.Association of Super-advanced Electronics Technologies (ASET) Tsukuba Center)

2001 International Conference on Solid State Devices and Materials |PDF Download

[B-2-4] GHz Clock Distribution Using Transmission Line Interconnect and CMOS Differential Driver Circuit in Si ULSI

Yoshisato Yokoyama, Tomohito Tsushima, Hiyouko Shinoki, Naohiro Takagi, Kazuya Masu (1.Precision and Intelligence Laboratory, Tokyo Institute of Technology)

2001 International Conference on Solid State Devices and Materials |PDF Download

[LB-1-1] Micro Bump Interconnection Technologies in 20 μm Pitch on 3D System in Package

Tadahiro Morifuji, Yoshihiro Tomita, Ryoichi Kajiwara, Kenji Takahashi (1.Association of Super-Advanced Electronics Technologies (ASET) Electronic System Integration Technology Research Department, Tsukuba Research Center Room C-B-5, Tsukuba Center Inc.)

2001 International Conference on Solid State Devices and Materials |PDF Download

[C-1-1] RF Power Performance of AlGaN/GaN HJFETs

N. Hayama, Y. Okamoto, K. Kasahara, T. Nakayama, Y. Ohno, H. Miyamoto, Y. Ando, M. Kazuhara, NEC, Japan (1.Photonic and Wireless Devices Research Laboratories, NEC Corporation, 2.The University of Tokushima)

2001 International Conference on Solid State Devices and Materials |PDF Download

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