The Japan Society of Applied Physics

533 results (111 - 120)

[D-2-2] Integrated RF-MEMS Technology with Wafer-Level Encapsulation

Kei Kuwabara, Masami Urano, Junichi Kodate, Norio Sato, Tomomi Sakata, Hiromu Ishii, Toshikazu Kamei, Kazuhisa Kudou, Masaki Yano, Katsuyuki Machida (1.NTT Microsystem Integration Laboratories, NTT Corporation, 2.NTT Advanced Technology Corporation)

2005 International Conference on Solid State Devices and Materials |PDF Download

[D-2-3] Thinning technology for lithium niobate wafer by surface activated bonding and chemical mechanical polishing

C. C. Wu, R. H. Horng, D. S. Wuu, T. N. Chen, C. J. Ting, H.Y. Tsai, C. P. Chou (1.Department of Materials Engineering, National Chung Hsing University, 2.Institute of Precision Engineering, National Chung Hsing University, 3.Mechanical Industry Research Laboratories, Industrial Technology Research Institute, 4.Department of Mechanical Engineering, National Chiao Tung University)

2005 International Conference on Solid State Devices and Materials |PDF Download

533 results (111 - 120)