The Japan Society of Applied Physics

540 results (351 - 360)

[PS-2-1] Joule Heating Induced Bonding Interface Improvement and Ti Breakthrough by Electron Bombardment for 40-μm Pitch of Cu TSV and Cu/Sn μ-Bump Pair

Y.J. Chang1, Y.S. Hsieh1, C.T. Ko1,2, W.C. Lo2, F.Y. Ouyang3, C.S. Wu4, Y.M. Cheng4, W.J. Chen4, K.N. Chen1 (1.NCTU, 2.Electronics and Optoelectronics Res. Lab., ITRI, 3.Department of Engineering and System Science, National Hsing Hua Univ., 4.Metal Industries R&D Centre (Taiwan))

2014 International Conference on Solid State Devices and Materials |PDF Download

540 results (351 - 360)