InGaAs Vertical Triple Barrier Single Electron Transistors

David Guy AUSTING, Takashi HONDA, Seigo TARUCHA (1.NTT Basic Research Laboratories)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.III-7] Observation of Coulomb Blockade Oscillations up to 50K from InP-Based InGaAs Quantum Wires Grown by Molecular Beam Epitaxy

Hiroshi OKADA, Hajime FUJIKURA, Tamotsu HASHIZUME, Hideki HASEGAWA (1.Research Center for Interface Quantum Electronics and Graduate School of Electronics and Information Engineering, Hokkaido University)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.III-8] The Resonant Tunneling Mode of a Single Electron Transistor

Kenji NATORI, Nobuyuki SANO (1.Institute of Applied Physics, University of Tsukuba)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.III-9] Coulomb Blockade Effects in Edge Quantum Wire SOI MOSFETs

Akiko Ohata, Akira Toriumi (1.ULSI Research Laboratories, Toshiba Corporation)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.I-1] Smart-Cut: A New S.O.I. Material Technology Based on Hydrogen Implantation and Wafer Bonding

MICHEL BRUEL, Bernard ASPAR Andre-Jacques AUBERTON-HERVE (1.LETI/CEA Departement de Microtechnologies, 2.SOITEC)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.I-2] Wafer Direct Bonding at Room Temperature by Means of the Surface Activated Bonding

Tadatomo SUGA, Taek Ryong CHUNG, Liu YANG, Naoe HOSODA, Hideki TAKAGI (1.The University of Tokyo, RCAST, 2.Mechanical Engineering Lab. AIST, MITI)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.I-3] Evolution of Extended Defects in High Temperature (T＞1150℃) Oxidized SIMOX

Luis Felipe GILES, Yasuo KUNII (1.NTT LSI. Labs., Nippon Telegraph and Telephone Co.)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.I-4] Vacuum Bonding for the Fabrication of PBSOI

G. Cha, B. H. Lee, K. W. Lee, G. J. Bae, J. Moon, S. I. Lee (1.Semiconductor R&D center, SAMSUNG Electronics Co., LTD)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.I-5] Thin Film Silicon on Insulator Substrate Considerations for CMOS Technologies

S. R. Wilson, T. Wetteroth, S. Hong, H. Shin, M. Racanelli, M. Huang (1.Materials Research and Strategic Technologies Communications Product Laboratories Motorola Semiconductor Products Sector)

1996 International Conference on Solid State Devices and Materials |PDF Download

[Sympo.I-6] Advanced SOI Devices Using CMP and Wafer Bonding

Hiroshi HORIE, Shunji NAKAMURA, Yasuo NARA, Kunihiro SUZUKI, Tetsu TANAKA, Masahiko IMAI, Akio ITOH, Yoshihiro ARIMOTO (1.Fujitsu Laboratories Ltd.)

1996 International Conference on Solid State Devices and Materials |PDF Download

298 results (151 - 160)

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