[C-6-2] Spin Injection and Transport in Ferromagnet/semiconductor Structures

C. J. Palmstrom (1.Univ. of Minnesota)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-7-1] Impacts of Cu/TaN Electrode on the Electrical Properties of Metal-insulator-metal (Ba,Sr)TiO3 Thin-film Capacitors

Wen-Fa Wu, Kou-Chiang Tsai, Chuen-Guang Chao, Jain-Tsai Lee, Wei-Che Chang, Tsung-Kuei Kang, Guo-Shen Jheng, Jian-Yang Lin (1.National Nano Device Laboratories, 2.Department of Materials Science and Engineering, National Chiao-Tung University, 3.Department of Electronic Engineering, Feng-Chia University, 4.Department of Electronic Engineering, National Yunlin University of Science and Technology)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-7-2] Fully Analytical Modeling of Cu Interconnects Up to 110 GHz

Jun-De Jin, Shawn S. H. Hsu, Tzu-Jin Yeh, Ming-Ta Yang, Sally Liu (1.Dept. of Electrical Engineering and Institute of Electronics Engineering, National Tsing Hua University, 2.Taiwan Semiconductor Manufacturing Company)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-7-3] A Small Area, 3-Dimensional On-chip Inductors for High-speed Signal Processing under Low Power Supply Voltages

Ken’ichiro Hijioka, Akira Tanabe, Yasushi Amamiya, Yoshihiro Hayashi (1.Device Platforms Research Labs., NEC Corporation)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-7-4] Wiring technology for analog and mixed signal LSIs

Akira Matsuzawa (1.Department of Physical Electronics, Tokyo Institute of Technology)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-8-1] Stress Migration Phenomenon in Narrow Copper Interconnects

Tomoji Nakamura, Takashi Suzuki (1.Fujitsu Laboratories Ltd.)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-8-2] Improvement of Adhesion at the Interface between Low-k Spin-on Dielectric and underlying SiCO Barrier by Plasma Treatments

Y. Takigawa, S. Nakao, M. Shiohara, N. Oda, S. Ogawa (1.Semiconductor Leading Edge Technologies, Inc.)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-8-3] Effect of temperature and film thickness on resistivity of CoWP

J. Gambino, F. Chen, S. Mongeon, D. Meatyard, E. Adams, P. DeHaven, C. Cabral Jr, I. Ivanov (1.IBM Microelectronics, 2.IBM Thomas J. Watson Research Center, 3.Blue29 LLC)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-8-4] Highly Reliable Cu Interconnect using Low Hydrogen Silicon Nitride Film Deposited at Low Temperature for Cu-Diffusion Barrier

T. Murata, K. Kono, Y. Tsunemine, M. Fujisawa, M. Matsuura, K. Asai, M. Kojima (1.Process Technology Development Division, Renesas Technology Corporation)

2007 International Conference on Solid State Devices and Materials |PDF Download

[C-9-1] Low-k/Cu Integration Consistent from 90nm thru 32nm (invited)

Takeshi Nogami (1.BEOL Technology Strategy T. J. Watson Research Center, IBM Corporation)

2007 International Conference on Solid State Devices and Materials |PDF Download