[E-2-4] Transfer Methods of Ultrathin Piezoelectric Strain Sensor to Flexible Printed Circuits

^○T. Yamashita¹, S. Takamatsu¹, H. Okada¹, T. Itoh², T. Kobayashi¹ (1.AIST, 2.Univ. of Tokyo(Japan))

2015 International Conference on Solid State Devices and Materials |2015年9月28日(月) 17:25 〜 17:45 |PDF ダウンロード

[E-2-5] 3D Sequential Integration via Direct Bonding of Highly Conductive Sputtered Tungsten Films

^○L. Benaissa^1,2, P. Gondcharton^1,2, B. Imbert^1,2, C. Sabbione^1,2, G. Rodriguez^1,2, D. Mariolle^1,2, D. Lafond^1,2 (1.Univ. Grenoble Alpes, 2.CEA-LETI, MINATEC Campus(France))

2015 International Conference on Solid State Devices and Materials |2015年9月28日(月) 17:45 〜 18:05 |PDF ダウンロード

[E-4-1] Mechanical Properties of Cu-Ni-Si alloy Evaluated by Micro-Tensile Test for Application in MEMS

^○S. Yanagida^1,2, A. Araki¹, T. F. M. Chang^1,2, C. Y. Chen^1,2, T. Nagoshi³, E. Kobayashi¹, H. Hosoda¹, T. Sato¹, M. Sone^1,2 (1.Tokyo Tech, 2.JST-CREST, 3.AIST(Japan))

2015 International Conference on Solid State Devices and Materials |2015年9月29日(火) 15:40 〜 16:00 |PDF ダウンロード

[E-4-2] The CeO₂ Sensing Membrane with NH₃ Plasma Treatment in Biosensor Applications

C. F. Lin¹, C. H. Kao¹, ^○S. W. Chang¹, C. W. Chang¹, C. L. Chang¹, Y. L. Su¹, Y. X. Huang¹ (1.Chang Gung Univ.(Taiwan))

2015 International Conference on Solid State Devices and Materials |2015年9月29日(火) 16:00 〜 16:20 |PDF ダウンロード

[E-4-3] Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor

^○Y. Takemoto¹, N. Takazawa¹, M. Tsukimura¹, H. Saito¹, T. Kondo¹, H. Kato¹, J. Aoki¹, K. Kobayashi¹, S. Suzuki¹, Y. Gomi¹, S. Matsuda¹, Y. Tadaki¹ (1.Olympus Corp.(Japan))

2015 International Conference on Solid State Devices and Materials |2015年9月29日(火) 16:20 〜 16:40 |PDF ダウンロード

[E-4-4L] Robustness of Integrated Stoppers for MEMS Accelerometer Fabricated by Multi-ｌayered Metal Technology

^○D. Yamane^1,4, T. Konishi², M. Takayasu^1,4, T. Safu², H. Toshiyoshi^3,4, M. Sone^1,4, K. Masu^1,4, K. Machida^1,2,4 (1.Tokyo Tech, 2.NTT Adv. Tech. Corp., 3.Univ. of Tokyo, 4.JST-CREST(Japan))

2015 International Conference on Solid State Devices and Materials |2015年9月29日(火) 16:40 〜 16:55 |PDF ダウンロード

[E-6-1] (Invited) 3D Interconnection of Single Micron Pitch by Hybrid Bonding Technology

M. Nimura¹, M. Ohyama¹, S. Shoji¹, M. Tamura², T. Enomoto², A. Shigetou³, ^○J. Mizuno¹ (1.Waseda Univ., 2.Nissan Chemical Indus., 3.NIMS(Japan))

2015 International Conference on Solid State Devices and Materials |2015年9月30日(水) 09:00 〜 09:30 |PDF ダウンロード

[E-6-2] Evaluation of 2-D Local Stress Distribution in Stacked IC Chip Using Stress-Induced Retention Time Modulation of DRAM Cell Array

^○S. Tanikawa¹, H. Hashiguchi¹, Y. Sugawara¹, H. Kino¹, T. Fukushima¹, M. Koyanagi¹, T. Tanaka¹ (1.Tohoku Univ.(Japan))

2015 International Conference on Solid State Devices and Materials |2015年9月30日(水) 09:30 〜 09:50 |PDF ダウンロード

[E-6-3] Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications

^○S. L. Lu¹, Y. P. Huang¹, Y. S. Huang¹, Y. H. Tseng², M. F. Shu², K. N. Chen¹ (1.National Chiao Tung Univ., 2.Advanced Semiconductor Engineering Group(Taiwan))

2015 International Conference on Solid State Devices and Materials |2015年9月30日(水) 09:50 〜 10:10 |PDF ダウンロード

[E-6-4] Novel Integration of Ultra-thin Al₂O₃ with Low-k Dielectric as Bi-layer Liner for Capacitance Optimization and Stress Mitigation in Cu-TSV

^○L. Zhang^1,2, H. Y. Li¹, Y. Shang², W. Yoo³, H. Yu², C. S. Tan² (1.Institute of Microelectronics, A*STAR, 2.Nanyang Technological Univ., 3.WaferMasters, Inc(Singapore))

2015 International Conference on Solid State Devices and Materials |2015年9月30日(水) 10:10 〜 10:30 |PDF ダウンロード