[G-7-3] Micro-Texture Dependence of Mechanical Properties of Fine Metallic Bumps Used for Three-Dimensional Electronic Packaging

K. Suzuki¹、R. Furuya¹、F. Endo¹、H. Miura¹ (1.Tohoku Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-8-1] Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization

T. Fukushima¹、M. Murugesan¹、J. Bea¹、K.W. Lee¹、M. Koyanagi¹ (1.Tohoku Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-8-2] Electromigration effect on mechanical shock behavior of Sn-Ag-Bi-In + Co solder joints for surface-mounted chip components

Y. Kim¹、S. Nagao¹、T. Sugahara¹、K. Suganuma¹ (1.Osaka Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[G-8-3] Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding

Y.J. Chang¹、C.T. Ko^1,2、Z.C. Hsiao²、H.C. Fu²、T.H. Yu¹、W.C. Lo²、K.N. Chen¹ (1.Department of Electronics Engineering, National Chiao Tung Univ.、2.Electronics and Optoelectronics Research Laboratories, ITRI (Taiwan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-1-1] Ultra-high Speed Image Sensors for Scientific Imaging

R. Kuroda¹、Y. Tochigi¹、K. Miyauchi¹、T. Takeda¹、R. Hirose²、H. Tominaga²、K. Takubo²、Y. Kondo²、S. Sugawa¹ (1.Tohoku Univ.、2.Shimadzu Corp. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-1-2] A CMOS Image Sensor Using Column-Parallel Forward Noise-Canceling Circuitry

T.L. Li¹、S. Wakashima¹、Y. Goda¹、R. Kuroda¹、S. Sugawa¹ (1.Univ. of Tohoku (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-1-3] A CMOS Image Sensor with High-speed Pixel-parallel Pipelined Readout Channels for Multi-point Fluorescence Correlation Spectroscopy

K. Kagawa¹、T. Takasawa¹、Z. Bo¹、M.W. Seo¹、K. Imai¹、J. Yamamoto²、M. Kinjo²、K. Yasutomi¹、S. Terakawa³、S. Kawahito¹ (1.Shizuoka Univ.、2.Hokkaido Univ.、3.Hamamatsu Univ. School of Medicine (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-1-4] A Wide Dynamic Range CMOS Image Sensor with 200-1100 nm Spectral Sensitivity and High Robustness to Ultraviolet Light Exposure

S. Nasuno¹、S. Kawada¹、Y. Koda¹、T. Nakazawa¹、K. Hanzawa¹、R. Kuroda¹、S. Sugawa¹ (1.Univ. of Tohoku (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-1-5] A High-Sensitivity Low Dark Current 1.75T/Pixel CMOS Image Sensor with Ring-Gate Shared-Pixel Design

M.W. Seo¹、K. Yasutomi¹、K. Kagawa¹、S. Kawahito¹ (1.Shizuoka Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-2-1] A 0-27 GHz -30 dB Isolation Tx/Rx Single Pole Double Throw (SPDT) Switch for Gaussian Monocycle Pulse Transmission

A. Azhari¹、K Sogo¹、M. Wang¹、A. Toya¹、T. Kikkawa¹ (1.Hiroshima Univ. (Japan))

2013 International Conference on Solid State Devices and Materials |PDF ダウンロード

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