[E-4-5] 60-GHz Single-chip Receiver 3-D MMIC using Commercial GaAs pHEMT Technology

Kenjiro Nishikawa, Belinda Piernas, Tadao Nakagawa, Katsuhiko Araki, Keizo Cho (1.NTT Network Innovation Laboratories, NTT Corporation, 2.Fujitsu Compound Semiconductor Inc.)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-3-1] The next technology platform based on mobile system and 3D integration

Akira MATSUZAWA (1.Advanced LSI Technology Development Center, Matsushita Electric Industrial Co., Ltd.)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-3-2] On-Chip Variable Inductor Using MEMS Technology

Yoshisato Yokoyama, Takashi Fukushige, Seiichi Hata, Kazuya Masu, Akira Shimokohbe (1.Precision and Intelligence Laboratory, Tokyo Institute of Technology)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-3-3] Behavior of Plated Micro-Bumps during Ultrasonic Flip-Chip Bonding Determined from Dynamic Strain Measurement

Naoya Watanabe, Tanemasa Asano (1.Center for Microelectronic Systems, Kyushu Institute of Technology)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-4-1] High Performance, Low Power Three-Dimensional Integrated Circuits for Next Generation Technologies

Lisa G. McIlrath (1.R3 Logic, Incorporated)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-4-2] Genuine Technologies for Three-Dimentional (3D) LSI

Katsuya Okumura, Nobuo Hayasaka (1.Research Center for Advanced Science and Technology, The University of Tokyo, 2.Semiconductor Company, Toshiba Corp.)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-4-3] Parallel Image Processing LSI Fabricated Using Three-Dimensional Integration Technology

D. Kawae, T. Nakamura, Y. Yamada, T. Morooka, Y. Igarashi, J. C. Shim, H. Kurino, M. Koyanagi (1.Dept. of Machine Intelligence and Systems Engineering, Tohoku University)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-4-4] Thermal Analysis of Self-Heating Effect in Three Dimensional LSI

T. Nakamura, Y. Yamada, T. Morooka, Y. Igarashi, J. C. Shim, H. Kurino, M. Koyanagi (1.Dept. of Machine Intelligence and Systems Engineering, Tohoku University)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-5-1] MEMS Based Nanotools for Detection and Manipulation at the Molecular Level

U. Staufer, L. Aeschimann, T. Akiyama, S. Gautsch, N. F. de Rooij (1.Sensors, Actuators and Microsystems Laboratory (SAMLAB) Institute of Microtechnology, University of Neuchatel)

2002 International Conference on Solid State Devices and Materials |PDF Download

[F-5-2] STP Sealing Technique for Surface Micromachined MEMS Stacked on a CMOS LSI

N. Sato, H. Ishii, S. Shigematsu, H. Morimura, K. Kudou, M. Yano, K. Machida (1.NTT Telecommunications Energy Labs., NTT Lifestyle and Environmental Technology Labs., NTT Corporation, 2.NTT Advanced Technology Corporation)

2002 International Conference on Solid State Devices and Materials |PDF Download