[D-2-4] A Novel Multi-Layered Hetero-Structure of Ni-Zn Ferrite/TaN Buffer for Effective Magnetic Core in On-Chip Inductors
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
707件中(101 - 110)
[D-2-5] System-on-Package Platform with Decoupling Capacitor Integration and Thermal Performance Improvement
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-2-6] Stabilities of La2O3 Metal-Insulator-Metal Capacitors under Constant Voltage Stress
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-4-1] Patterning & Metallization Options for Advanced Contact Module Integration
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-4-2] Effect of Via-Profile on the Via Reliability in Scaled-down Low-k/Cu Interconnects
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-4-3] On the Reliability of Cu Contacts for the 32nm Technology Node and beyond
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-5-1] High Resolution and Thermodynamic Analysis of Interconnect Metals and Diffusion Barriers.
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-5-2] Rutherford Backscattering Spectrometry Analysis of Growth of Ti-Rich Layer Formed at Cu(Ti)/Low-k Interfaces
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-5-3] A Comparison of Lifetime Improvements in Electromigration between Ti Barrier Metal and CVD Co Capping
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード
[D-6-1] Recent Progress in High-Resolution and High-Speed CMOS Image Sensor Technology
2009 International Conference on Solid State Devices and Materials |PDF ダウンロード