[K-3-2] Sub-micron-accuracy Gold to Gold Interconnection Flip-Chip Bonding Approach for Electronics-Optics Heterogeneous Integration

T. T. Bui¹、L. Ma¹、M. Suzuki¹、F. Kato¹、S. Nemoto¹、N. Watanabe¹、M. Aoyagi¹ (1.National Inst. of Advanced Industrial Science and Tech. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-3-3] Optoelectronic Heterogeneous Integration Tech. Using Reductant-assisited Self-Assembly with Cu/Sn Microbump

Y. Ito^1,2、T. Fukushima²、K. W. Lee²、K. Choki¹、T. Tanaka²、M. Koyanagi² (1.Sumitomo Bakelite Co., Ltd.、2.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-3-4] Impact of Al and Cu electrodes on GeOx/W for high-performance crossbar resistive switching memories

S. Z. Rahaman¹、S. Maikap¹、C. S. Lai¹、H. Y. Lee²、W. S. Chen²、F. Chen²、M. J. Tsai² (1.Chang Gung Uinv.、2.Indus. Techn. Res. Inst. , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-4-1] 3D Integration with Wafer-to-Wafer Bonding

W. C. Lo¹、C. T. Ko^1,2、K. N. Chen² (1.Electronics and Optoelectronics Research Laboratories, Industrial Tech. Research Inst. (ITRI),、2.National Chiao Tung Univ., , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-4-2] Room-Temperature Cu Microjoining Using Ultrasonic Bonding of Cone Shaped Bump

L. J. Qiu¹、T. Asano¹、K. Noda²、S. Nakai² (1.Kyushu Univ.、2.Adwelds Co.,Ltd , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-4-3] Electrostatic Temporary Bonding Tech. and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration

H. Hashiguchi¹、J. C. Bea²、Y. Ohara¹、T. Fukushima²、K. W. Lee²、T. Tanaka^1,3、M. Koyanagi² (1.Dept. of Bioengineering and Robotics, Tohoku Univ.、2.New Industry Creation Hatchery Center , Tohoku Univ.、3.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-5-1] Thermal and Mechanical Stress in High-Density 3D-LSIs

M. Murugesan¹、H. Kobayashi²、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.、2.ASET , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-5-2] Dominant Structural Factors of Residual Stress Distribution in Stacked Silicon Chips Mounted in 3D Packages and Modules

K. Suzuki¹、H. Tago¹、F. Endo¹、N. Murata¹、H. Miura¹ (1.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-5-3] TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current

C. S. Tan¹、J. Zhang¹、K. Ghosh¹、L. Zhang¹、Y. Dong³、H. Yu²、C. M. Tan¹、G. Xia³ (1.Nanyang Technological Univ.、2.Inst. of Microelectronics , Singapore、3.Univ. of British Columbia , Canada)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[K-6-1] Racetrack Memory 2.0

S. S.P. Parkin¹ (1.IBM Almaden Research Center , USA)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

665件中(331 - 340)

« 前へ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
次へ »

▲