Ge Gate Stack Structure

K. Kato¹, M. Sakashita¹, W. Takeuchi¹, H. Kondo¹, O. Nakatsuka¹, S. Zaima¹ (1.Nagoya Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-1] Development of Versatile Backside Via Technology for 3D System on Chip

Y. Ohara¹, K. Lee¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-2] RF Modeling of Through Silicon Vias (TSVs) in 3D IC

C. W. Luo¹, Y. C. Wu¹, J. Y. Wang¹, S. S. H. Hsu¹ (1.National Tsing Hua Univ. , Taiwan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-3] Stress Mapping of Silicon Surrounded by Various Through Silicon Via (TSV) Patterns using Polychromator-Based Multi-Wavelength Raman Spectroscopy

A. D. Trigg¹, L. H. Yu¹, C. C. Kuo¹, R. Kumar¹, D. L. Kwong¹, T. Ueda², T. Ishigaki², K. Kang², W. S. Yoo² (1.Insitute of Microelectronics , Singapore, 2.WaferMasters, Inc. , USA)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-4] Above-CMOS Metal-Pattern Technique for Flexible Inductance Adjustment in Rapid Prototyping of RF SoCs

K. Kotani¹, A. Sugimoto¹, Y. Omiya¹, T. Ito¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-5] Modeling and Co-Design of Novel Packaging Interposer with IPD Layers

S. M. Wu¹, T. Y. Wu¹, B. H. Yu¹, C. C. Wang² (1.National Univ. of Kaohsiung, 2.Electrical Lab., Corp. Design Division, Corporate R&D, Advanced Semiconductor Engineering (ASE) Inc., Kaohsiung , Taiwan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-6] Multi-Line De-Embedding Technique for Millimeter-Wave Circuit Design

Q. H. Bu¹, N. Li¹, N. Takayama¹, K. Okada¹, A. Matsuzawa¹ (1.Tokyo Tech , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-7] Numerical Simulation of Organic Low-k Etching in H₂/N₂ Plasma

T. Yagisawa¹, T. Makabe¹ (1.Keio Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-8] Smooth Patterning of Ru Film by Electrochemical Etching using Organic based Solution

L. Yang¹, R. Sakae¹, M. Yashimaru², M. Yamaguchi², I. Kanno², M. Tanaka², C. Kimura¹, H. Aoki¹ (1.Osaka Univ., 2.STARC , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

[P-2-9] Effect of Annealing on Electrical Properties of Networked-Nanographite Wire Grown by Metal-Photoemission-assisted Plasma-enhanced CVD

M. Sato^1,2,3, S. Ogawa^3,4, T. Kaga⁴, E. Ikenaga^3,5, Y. Takakuwa^3,4, M. Nihei^1,2,3, N. Yokoyama² (1.Fujitsu Ltd., 2.Fujitsu Labs Ltd., 3.CREST-JST, 4.Tohoku Univ., 5.JASRI , Japan)

2010 International Conference on Solid State Devices and Materials |PDF Download

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