[P-2-2] Improvement of Cu seedless Ru barrier by insertion of an amorphous WCoCN interlayer

J. B. Yeh¹, D. C. Perng¹, K. C. Hsu¹ (1.National Cheng Kung Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-3] Suppression of Fluorine Diffusion into Low-k Material (Methyl-BCN) using Low Temperature Etching

M. Hara¹, T. Masuzumi¹, L. Zhiming¹, C. Kimura¹, H. Aoki¹, T. Sugino¹ (1.Osaka Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-4] Novel Particle Reduction System in Chemical-Vapor-Deposition Process of Interlayer Dielectrics

M. Sato¹, H. Ohtake¹, S. Samukawa¹ (1.Tohoku Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-5] Prediction of UV/VUV Irradiation Damage of Interlayer Dielectrics in Plasma Etching using on-wafer Monitoring Technique

B. Jinnai¹, S. Fukuda¹, H. Ohtake¹, S. Yasuhara², E. A. Hudson³, S. Samukawa¹ (1.Tohoku Univ.(Japan), 2.Japan Advanced Chemicals(Japan), 3.Lam Res. Corp.(USA))

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-6] Low-Temperature Silicon Oxide Offset Spacer using Plasma Enhanced Atomic Layer Deposition for High-k/Metal Gate Transistor

T. Murata¹, Y. Miyagawa¹, Y. Nishida¹, Y. Yamamoto¹, T. Yamashita¹, M. Matsuura¹, K. Asai¹ (1.Renesas Tech. Corp.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-7] Impact of film structures on damage to low-k SiOCH film during plasma exposure

S. Yasuhara¹, T. Sasaki¹, K. Tajima², H. Yano², S. Kadomura², M. Yoshimaru², N. Matsunaga², S. Samukawa¹ (1.Tohoku Univ.(Japan), 2.STARC(Japan))

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-8] Raman Spectroscopic Metrology for Stress measurement in Semiconductor Device Development and Process

N. Naka¹, S. Kashiwagi¹, K. Ohtsuki¹, J. H. Kim², C. H. Lee², S. T. Ahn², K. H. Bae², H. W. Yoo², C. H. Kim² (1.HORIBA, Ltd.(Japan), 2.Hynix Semiconductor Inc.(Korea))

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-9] Uniaxial Tensile Testing System for Quantitative Stress Analysis in Silicon Oxide Thin Films by Cathodoluminescence Spectroscopy

N. Goami¹, N. Yamashita¹, N. Araki¹, S. Kakinuma², K. Nishikata², N. Naka², K. Matsumoto², T. Namazu¹, S. Inoue¹ (1.Univ. of Hyogo(Japan), 2.HORIBA Ltd.(Japan))

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-10] Liquid Phase Bonding using Au Compliant Bumps for Fine-Pitch Solder Bump Interconnection

L. J. Qiu¹, N. Watanabe¹, T. Asano¹ (1.Kyushu Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

[P-2-11] Room-Temperature Large-Number Inter-Chip Connections using Mechanical Caulking Effect of Compliant Bump

N. Watanabe¹, T. Asano¹ (1.Kyushu Univ.)

2009 International Conference on Solid State Devices and Materials |PDF Download

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