[P-2-10] Thermal Cycling Reliability of ChipArray® Thin Core Ball Grid Array assemblies with Fast Cure and Reworkable Capillary Flow Underfill
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
741件中(491 - 500)
[P-2-11] Selective Heating of Microbumps Using Microwave for Low Strain Heterogeneous Chip Stack Integration
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-2-12] Room temperature fabrication of silver nanowire transparent electrodes
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-2-13] Low-Energy Ion-Beam-Assisted Sputtering for Si Nanocrystals
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-2-14] Highly Accurate Lattice-Strain mapping near Interfaces of Hetero-Structures by Convergent-Beam and Nano-Beam Electron Diffraction
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-2-15] Multi-layer Graphene for High-Frequency Interconnect
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-2-16] Investigation of Electrical Properties of HfN/HfSiON Gate Stacks In-situ Formed on Si(100) and Si(110)
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-2-17] Linear Combination of Bulk Bands-Method and Atomistic Tight-Binding Description of Strained Silicon and Germanium Layers
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-2-18L] MIM Capacitors with High Capacitance Density and Low Quadratic Voltage Coefficient by Employing Crystalline-TiO2/SiO2 Stacked Dielectric
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード
[P-3-1] Impact of Aspect Ratio on the Subthreshold RTN Amplitude of Multi-Gate MOSFETs
2011 International Conference on Solid State Devices and Materials |PDF ダウンロード