[C-5-1] Through Silicon Via (TSV) Fabrication with Low-k Dielectric Liner and Its Implications on Parasitic Capacitance and Leakage Current

L. Zhang^1,2、H. Y. Li¹、S. Gao¹、C. S. Tan² (1.A*STAR、2.Nanyang Technological University , Singapore)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-5-2] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI

H. Kino¹、M. Murugesan¹、K. W. Lee¹、J. C. Bea¹、C. Miyazaki²、H. Kobayashi²、H. Shimamoto²、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.、2.ASET , Japan)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-5-3] Room-Temperature Bonding of LSI Chips on PEN Film Using Mechanical Caulking of Au Cone Bump

T. Shuto¹、N. Watanabe¹、A. Ikeda¹、T. Asano¹ (1.Kyushu Univ. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-5-4] 3D Chip Stacking of RF Devices with Cu TSV, Cu/Sn Bumps and Sealing Ring

W. Zhang¹、B. Majeed¹、X. Sun¹、G. Posada¹、C. Diekmann²、C. Eggs²、E. Schmidhammer²、W. De Raedt¹ (1.IMEC , Belgium、2.EPCOS AG , Germany)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-1] Low temperature curable nano-inks for printed wiring and transparent films

K. Suganuma¹、M. Nogi¹、T. Tokuno¹、J. Jiu¹ (1.Osaka Univ. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-2] Stress from Tungsten-Filled TSVs Measured by Raman Spectroscopy on Cross-Sectional Samples

J. Gambino¹、D. Vanslette¹、B. Webb¹、C. Luce¹、G. Chrisman¹、T. Ueda²、T. Ishigaki²、K. Kang²、W. S. Yoo² (1.IBM、2.WaferMasters, Inc. , USA)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-3] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs

H. Hashiguchi¹、M. Murugesan¹、J. C. Bea¹、K. W. Lee¹、T. Fukushima¹、H. Kobayashi²、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ.、2.Association of Super-Advanced Electronics Tech. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-4] Size and Deformation Mode Dependencies on the Strength of Dry-Etched Single Crystal Silicon Micro-Beams

T. Namazu^1,2、H. Yamagiwa¹、T. Fujii¹、M. Saito³、K. Yamada³、T. Miyatake³ (1.Univ. of Hyogo、2.PRESTO-JST、3.Panasonic Electric Works Co., Ltd. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-8-5] Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution

N. Shishido^1,5、C. Chen¹、H. Sato^1,5、S. Kamiya^1,5、M. Nishida^1,5、M. Omiya^2,5、T. Nokuo^3,5、T. Nagasawa^3,5、T. Suzuki⁴、T. Nakamura⁴ (1.Nagoya Inst. of Tech.、2.Keio Univ.、3.JEOL Ltd.、4.Fujitsu Labs Ltd.、5.CREST-JST , Japan)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

[C-9-1] In Situ Analysis of Plasma-Induced Modification on Porous SiOCH Films

H. Yamamoto¹、K. Asano¹、K. Ishikawa¹、K. Takeda¹、H. Kondo¹、M. Sekine¹、M. Hori¹ (1.Nagoya Univ. , Japan)

2011 International Conference on Solid State Devices and Materials |PDF ダウンロード

741件中(111 - 120)

« 前へ
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
次へ »

▲