[J-6-3] -119.1 dBc/Hz Phase Noise Ring-VCO-Based PLL CMOS Circuit Using A Tunable Narrow-Deadzone Creator in Frequency Locked Loop

K. Sogo¹, A. Toya^1,2, T. Kikkawa¹ (1.Hiroshima Univ., 2.Kure National Collage of Tech. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[J-6-4] 150GHz Divide-by-Three CMOS Frequency Divider with Power Line Injection

K. Takano¹, M. Motoyoshi¹, K. Katayama¹, M. Fujishima¹ (1.Hiroshima Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[J-7-1] Fractionally Injection-Locked Frequency Multiplication Technique with Multi-Phase Ring VCO

S. Ikeda¹, S. Lee¹, T. Kamimura¹, H. Ito¹, N. Ishihara¹, K. Masu¹ (1.Tokyo Tech. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[J-7-2] Analysis and Design of Coil with Feed Line for ThruChip Interface

M. Saito¹, N. Miura¹, T. Kuroda¹ (1.Keio Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[J-7-3] THz Matrix-Based Layered Wrapper Model of Common-Source MOSFET

K. Katayama¹, M. Motoyoshi¹, K. Takano¹, M. Fujishima¹ (1.Hiroshima Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-2-1] Chemical Soldering: New Method for Single Molecular Interconnects

Y. Okawa¹, M. Aono² (1.International Center for Materials Nanoarchitectonics (WPI-MANA), 2.National Inst. for Materials Science (NIMS) , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-2-2] Growth of Dense Vertical and Horizontal Graphene for Thermal Vias and its Thermal Property

A. Kawabata¹, T. Murakami¹, M. Nihei¹, N. Yokoyama¹ (1.AIST , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-2-3] Annealing Condition Optimization of Sputtered Amorphous Carbon for Large-grain, Multi-layer Graphene

M. Sato¹, H. Nakano¹, M. Takahashi¹, T. Muro², Y. Takakuwa³, S. Sato¹, M. Nihei¹, N. Yokoyama¹ (1.AIST/GNC, 2.JASRI/SPring-8, 3.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-2-4] Integrating carbon nanotubes as vias in a monolithic 3DIC process

S. Vollebregt¹, R. Ishihara¹, A.N. Chiaramonti², J. Bin Abdul Jalil¹, K. Beenakker¹ (1.Delft Univ. of Tech. , The Netherlands, 2.National Inst. of Standards and Tech. , United States of America)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-3-1] Silicon photonics transceivers with integrated hybrid lasers

J. M. Fedeli¹, D. Virot^1,2,3, G. H. Duan⁵, L. Vivien², D. Thomason⁶, J. M. Hartmann¹, C. Jany⁵, P. Grosse¹, A. Le Liepvre⁵, R. Bogaerts⁴, G. Reed⁶, D. Van Thourhout⁴, F. Lelarge⁵ (1.CEA, LETI, Minatec Campus, 2.Institut d'Electronique Fondamentale (IEF), Univ., 3.STMicroelectronics, Silicon Tech. Development , France, 4.Photonic Research Group,– Ghent Univ. , Belgium, 5.III-V Lab, a joint lab of Alcatel-Lucent Bell Labs France, Thales Research and CEA , France, 6.ECS/ORC, Univ. of Southampton , UK)

2012 International Conference on Solid State Devices and Materials |PDF Download