[PS-2-3] 10-μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications

T. Fukushima¹, J. Bea¹, M. Murugesan¹, K. Lee¹, T. Tanaka², M. Koyanagi¹ (1.Tohoku Univ., 2.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-4] Grapho-Assembly Tech. for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps

T. Fukushima¹, M. Onishi¹, J. Bea¹, S. Hioki¹, M. Murugesan¹, K. Lee¹, T. Tanaka², M. Koyanagi¹ (1.New Industry Creation Hatchery Center (NICHe), 2.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-5] The Influence of Cu Diffusion from Cu Through-Silicon Via(TSV) on Device Reliability in the 3-D LSI by Using C-V and C-t Measurements

J. C. Bea¹, K. W. Lee¹, T. Fukushima¹, T. Tanaka², M. Koyanagi¹ (1.New Industry Creation Hatchery Center (NICHe), Tohoku Univ., 2.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-6] Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration

H. Kino¹, J. C. Bea¹, M. Murugesan¹, K. W. Lee¹, T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-7] The results of self annealing process for a copper interconnection on the 4xnm DRAM Products

H. J. Park¹, I. C. Ryu², S. H. Son², J. S. Im³, J. H. Kwon³, Y. P. Song¹, K. S. Jang¹, C. R. Lee¹, J. O. Nam¹, K. I. Yoon¹, K. S. Yoon¹ (1.DRAM Development Division, 2.Research Divisoin, 3.Manufacturing Division , Korea)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-8] Evaluation of Threshold Current Density in Interconnect with Reservoir Structure Using Numerical Modeling of Electromigration Damage

K. Sasagawa¹, T. Yanagi¹ (1.Hirosaki Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-9] Layered Low-k Porous Silica Zeolite Films for Inter-Metal Dielectric with High Elastic Modulus

T. Yamamoto¹, T. Sato¹, Y. Seino², K. Hattori², S. Kuroki¹, T. Kikkawa¹ (1.Hiroshima Univ, 2.AIST , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-10] RF Inductors on Nanocrystalline Silicon Passivated HR-Si Substrates

R. L. Wang¹, Y. R. Lin¹, P. Y. Liu¹, C. J. Chen², Y. K. Su², T. J. Hsueh³ (1.National Kaohsiung Normal Univ., 2.National Cheng Kung Univ., 3.National Nano Device Labs. , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-11] Reduction of sheet resistances of PtSi alloying with Hf formed by Kr sputtering

Y. Yoshimura¹, S. Ohmi¹ (1.Tokyo Tech. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[PS-2-12] Fabrication of TiN/Si Contact with Low Electron Barrier Height and Electrical Characterization of Si-On-Insulator Using Back-Gate MOSFET

K. Asakawa¹, K. Yamamoto¹, D. Wang¹, H. Nakashima¹ (1.Kyushu Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

665 results (431 - 440)

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