[K-3-2] Sub-micron-accuracy Gold to Gold Interconnection Flip-Chip Bonding Approach for Electronics-Optics Heterogeneous Integration

T. T. Bui¹, L. Ma¹, M. Suzuki¹, F. Kato¹, S. Nemoto¹, N. Watanabe¹, M. Aoyagi¹ (1.National Inst. of Advanced Industrial Science and Tech. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-3-3] Optoelectronic Heterogeneous Integration Tech. Using Reductant-assisited Self-Assembly with Cu/Sn Microbump

Y. Ito^1,2, T. Fukushima², K. W. Lee², K. Choki¹, T. Tanaka², M. Koyanagi² (1.Sumitomo Bakelite Co., Ltd., 2.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-3-4] Impact of Al and Cu electrodes on GeOx/W for high-performance crossbar resistive switching memories

S. Z. Rahaman¹, S. Maikap¹, C. S. Lai¹, H. Y. Lee², W. S. Chen², F. Chen², M. J. Tsai² (1.Chang Gung Uinv., 2.Indus. Techn. Res. Inst. , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-4-1] 3D Integration with Wafer-to-Wafer Bonding

W. C. Lo¹, C. T. Ko^1,2, K. N. Chen² (1.Electronics and Optoelectronics Research Laboratories, Industrial Tech. Research Inst. (ITRI),, 2.National Chiao Tung Univ., , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-4-2] Room-Temperature Cu Microjoining Using Ultrasonic Bonding of Cone Shaped Bump

L. J. Qiu¹, T. Asano¹, K. Noda², S. Nakai² (1.Kyushu Univ., 2.Adwelds Co.,Ltd , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-4-3] Electrostatic Temporary Bonding Tech. and TSV Formation for Reconfigured Wafer-to-Wafer 3D Integration

H. Hashiguchi¹, J. C. Bea², Y. Ohara¹, T. Fukushima², K. W. Lee², T. Tanaka^1,3, M. Koyanagi² (1.Dept. of Bioengineering and Robotics, Tohoku Univ., 2.New Industry Creation Hatchery Center , Tohoku Univ., 3.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-5-1] Thermal and Mechanical Stress in High-Density 3D-LSIs

M. Murugesan¹, H. Kobayashi², T. Fukushima¹, T. Tanaka¹, M. Koyanagi¹ (1.Tohoku Univ., 2.ASET , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-5-2] Dominant Structural Factors of Residual Stress Distribution in Stacked Silicon Chips Mounted in 3D Packages and Modules

K. Suzuki¹, H. Tago¹, F. Endo¹, N. Murata¹, H. Miura¹ (1.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-5-3] TSV Scaling with Constant Liner Thickness and the Related Implications on Thermo-mechanical Stress, Capacitance, and Leakage Current

C. S. Tan¹, J. Zhang¹, K. Ghosh¹, L. Zhang¹, Y. Dong³, H. Yu², C. M. Tan¹, G. Xia³ (1.Nanyang Technological Univ., 2.Inst. of Microelectronics , Singapore, 3.Univ. of British Columbia , Canada)

2012 International Conference on Solid State Devices and Materials |PDF Download

[K-6-1] Racetrack Memory 2.0

S. S.P. Parkin¹ (1.IBM Almaden Research Center , USA)

2012 International Conference on Solid State Devices and Materials |PDF Download

665 results (331 - 340)

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