[PS-2-3] 10-μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications

T. Fukushima¹、J. Bea¹、M. Murugesan¹、K. Lee¹、T. Tanaka²、M. Koyanagi¹ (1.Tohoku Univ.、2.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-4] Grapho-Assembly Tech. for Sub-Micron Accuracy 3D Chip Stacking with High-Density Through-Si Vias and Metal Microbumps

T. Fukushima¹、M. Onishi¹、J. Bea¹、S. Hioki¹、M. Murugesan¹、K. Lee¹、T. Tanaka²、M. Koyanagi¹ (1.New Industry Creation Hatchery Center (NICHe)、2.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-5] The Influence of Cu Diffusion from Cu Through-Silicon Via(TSV) on Device Reliability in the 3-D LSI by Using C-V and C-t Measurements

J. C. Bea¹、K. W. Lee¹、T. Fukushima¹、T. Tanaka²、M. Koyanagi¹ (1.New Industry Creation Hatchery Center (NICHe), Tohoku Univ.、2.Dept. of Biomedical Engineering, Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-6] Analysis of Local Bending Stress Effect on CMOS Performance Fabricated in Thinned Si Chip for Chip-to-Wafer 3D Integration

H. Kino¹、J. C. Bea¹、M. Murugesan¹、K. W. Lee¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-7] The results of self annealing process for a copper interconnection on the 4xnm DRAM Products

H. J. Park¹、I. C. Ryu²、S. H. Son²、J. S. Im³、J. H. Kwon³、Y. P. Song¹、K. S. Jang¹、C. R. Lee¹、J. O. Nam¹、K. I. Yoon¹、K. S. Yoon¹ (1.DRAM Development Division、2.Research Divisoin、3.Manufacturing Division , Korea)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-8] Evaluation of Threshold Current Density in Interconnect with Reservoir Structure Using Numerical Modeling of Electromigration Damage

K. Sasagawa¹、T. Yanagi¹ (1.Hirosaki Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-9] Layered Low-k Porous Silica Zeolite Films for Inter-Metal Dielectric with High Elastic Modulus

T. Yamamoto¹、T. Sato¹、Y. Seino²、K. Hattori²、S. Kuroki¹、T. Kikkawa¹ (1.Hiroshima Univ、2.AIST , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-10] RF Inductors on Nanocrystalline Silicon Passivated HR-Si Substrates

R. L. Wang¹、Y. R. Lin¹、P. Y. Liu¹、C. J. Chen²、Y. K. Su²、T. J. Hsueh³ (1.National Kaohsiung Normal Univ.、2.National Cheng Kung Univ.、3.National Nano Device Labs. , Taiwan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-11] Reduction of sheet resistances of PtSi alloying with Hf formed by Kr sputtering

Y. Yoshimura¹、S. Ohmi¹ (1.Tokyo Tech. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード

[PS-2-12] Fabrication of TiN/Si Contact with Low Electron Barrier Height and Electrical Characterization of Si-On-Insulator Using Back-Gate MOSFET

K. Asakawa¹、K. Yamamoto¹、D. Wang¹、H. Nakashima¹ (1.Kyushu Univ. , Japan)

2012 International Conference on Solid State Devices and Materials |PDF ダウンロード