Ge Gate Stack Structure

K. Kato¹、M. Sakashita¹、W. Takeuchi¹、H. Kondo¹、O. Nakatsuka¹、S. Zaima¹ (1.Nagoya Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-1] Development of Versatile Backside Via Technology for 3D System on Chip

Y. Ohara¹、K. Lee¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-2] RF Modeling of Through Silicon Vias (TSVs) in 3D IC

C. W. Luo¹、Y. C. Wu¹、J. Y. Wang¹、S. S. H. Hsu¹ (1.National Tsing Hua Univ. , Taiwan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-3] Stress Mapping of Silicon Surrounded by Various Through Silicon Via (TSV) Patterns using Polychromator-Based Multi-Wavelength Raman Spectroscopy

A. D. Trigg¹、L. H. Yu¹、C. C. Kuo¹、R. Kumar¹、D. L. Kwong¹、T. Ueda²、T. Ishigaki²、K. Kang²、W. S. Yoo² (1.Insitute of Microelectronics , Singapore、2.WaferMasters, Inc. , USA)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-4] Above-CMOS Metal-Pattern Technique for Flexible Inductance Adjustment in Rapid Prototyping of RF SoCs

K. Kotani¹、A. Sugimoto¹、Y. Omiya¹、T. Ito¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-5] Modeling and Co-Design of Novel Packaging Interposer with IPD Layers

S. M. Wu¹、T. Y. Wu¹、B. H. Yu¹、C. C. Wang² (1.National Univ. of Kaohsiung、2.Electrical Lab., Corp. Design Division, Corporate R&D, Advanced Semiconductor Engineering (ASE) Inc., Kaohsiung , Taiwan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-6] Multi-Line De-Embedding Technique for Millimeter-Wave Circuit Design

Q. H. Bu¹、N. Li¹、N. Takayama¹、K. Okada¹、A. Matsuzawa¹ (1.Tokyo Tech , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-7] Numerical Simulation of Organic Low-k Etching in H₂/N₂ Plasma

T. Yagisawa¹、T. Makabe¹ (1.Keio Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-8] Smooth Patterning of Ru Film by Electrochemical Etching using Organic based Solution

L. Yang¹、R. Sakae¹、M. Yashimaru²、M. Yamaguchi²、I. Kanno²、M. Tanaka²、C. Kimura¹、H. Aoki¹ (1.Osaka Univ.、2.STARC , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[P-2-9] Effect of Annealing on Electrical Properties of Networked-Nanographite Wire Grown by Metal-Photoemission-assisted Plasma-enhanced CVD

M. Sato^1,2,3、S. Ogawa^3,4、T. Kaga⁴、E. Ikenaga^3,5、Y. Takakuwa^3,4、M. Nihei^1,2,3、N. Yokoyama² (1.Fujitsu Ltd.、2.Fujitsu Labs Ltd.、3.CREST-JST、4.Tohoku Univ.、5.JASRI , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

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