[H-6-1] Cu Alloys and Noble Metal Liner Materials to Extend Damascene Cu Schemes

T. Nogami¹ (1.IBM , USA)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-2] Migration of Copper through Tungsten-Filled Via on Single Damascene Copper Interconnect

B. M. Kim¹、J. J. Kim¹、B. M. Seo¹、J. S. Oh¹、J. Y. Cho¹、J. Lee¹、K. Hong¹、B. H. Choi¹、S. Park¹ (1.Hynix Semiconductor Inc. , Korea)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-3] The Effects of Pre-existing Voids on Electromigration Lifetime Scaling

C. V. Thompson¹ (1.MIT , USA)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-6-4] Structure Analyses of Ti-Based Self-Formed Barrier Layers

K. Kohama¹、K. Ito¹、Y. Sonobayashi¹、K. Ohmori²、K. Mori²、K. Maekawa²、Y. Shirai¹、M. Murakami³ (1.Kyoto Univ.、2.Renesas Electronics. Corp.、3.The Ritsumeikan Trust , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-7-1] 3D Integration Technology and 3D System-on- a Chip

M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-7-2] Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time(C-t) measurement"

J. C. Bea¹、K. W. Lee¹、M. Murugesan¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-7-3] Through Silicon Photonic Via with Si core for Low loss and High Density Vertical Optical Interconnection in 3D-LSI

A. Noriki¹、K. W. Lee¹、J. Bea¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-8-1] Low temperature bonding for 3D integration

T. Suga¹ (1.Univ. of Tokyo , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-8-2] Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration

E. Iwata¹、Y. Ohara¹、K. W. Lee¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

[H-8-3] Metal Micro-Bump Induced Stress in 3D-LSIs _a micro-Raman Study

M. Murugesan¹、Y. Ohara¹、J. C. Bea¹、K. W. Lee¹、T. Fukushima¹、T. Tanaka¹、M. Koyanagi¹ (1.Tohoku Univ. , Japan)

2010 International Conference on Solid State Devices and Materials |PDF ダウンロード

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